IP Library › Granted Patent US 892,066
Granted Patent S1
US 892,066 · App. 29/655,949 · Granted Aug 4, 2020

LED package

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Quick Facts
Patent No.
US 892,066
App. No.
29/655,949
Granted
Aug 4, 2020
Kind
S1
Claims (1)

The ornamental design for LED packages, as shown and described herein.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 056137/0452 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2018
From: REIHERZER, JESSE; NEVINS, JEREMY; CLARK, JOSEPH
To: CREE, INC.
Reel/Frame 046298/0060 →