IP Library Assignment 056137/0452
Patent Assignment
Reel/Frame 056137/0452

Assignment of Assignor's Interest

Recorded: 2021-05-05 Pages: 240
Assignor
CREE, INC.
Executed: 2021-03-01
Assignee
CREELED, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
Covered Properties (14)
Coating method utilizing phosphor containment structure and devices fabricated using same
Application: 11/827,626 →
Publication: US 2009/0014736
LED array and method for fabricating same
Application: 11/982,276 →
Publication: US 2008/0170396
Molded Chip Fabrication Method and Apparatus
Application: 12/506,989 →
Publication: US 2009/0278156
Light Transmission Control for Masking Appearance of Solid State Light Sources
Application: 12/842,639 →
Publication: US 2012/0018754
Molded Chip Fabrication Method and Apparatus
Application: 12/862,640 →
Publication: US 2010/0323465
Compact Optically Efficient Solid State Light Source with Integrated Thermal Management
Application: 13/177,415 →
Publication: US 2013/0009179
Chip with Integrated Phosphor
Application: 14/053,404 →
Publication: US 2014/0217443
Compact Led Package with Reflectivity Layer
Application: 14/183,218 →
Publication: US 2014/0291715
Led Packages with Chips Having Insulated Surfaces
Application: 14/478,571 →
Publication: US 2016/0072022
Led Package with Multiple Element Light Source and Encapsulant Having Curved and/or Planar Surfaces
Application: 14/575,805 →
Publication: US 2015/0179903
High Efficiency Leds and Methods of Manufacturing
Application: 14/602,040 →
Publication: US 2016/0211420
Self-Aligned Floating Mirror for Contact Vias
Application: 14/860,483 →
Publication: US 2016/0087173
Wire Bond Free Wafer Level Led
Application: 15/449,510 →
Publication: US 2017/0179088
Led Package
Patent: 892,066 →
Application: 29/655,949 →
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 10, 2013
From: HEIKMAN, STEN; IBBETSON, JAMES; YAO, ZHIMIN JAMIE; ZHANG, FAN
To: CREE, INC.
Reel/Frame 032057/0101 →
Assignment of Assignor's Interest Feb 21, 2014
From: REIHERZER, JESSE; NEVINS, JEREMY; BERGMANN, MICHAEL JOHN; CLARK, JOSEPH GATES
To: CREE, INC.
Reel/Frame 032273/0576 →
Assignment of Assignor's Interest Oct 28, 2014
From: LOWES, THEODORE; WILCOX, KURT W.; KELLER, BERND; BHAT, CHANDAN
To: CREE, INC.
Reel/Frame 034050/0136 →
Assignment of Assignor's Interest Dec 30, 2014
From: PUN, ARTHUR; NEVINS, JEREMY; REIHERZER, JESSE; CLARK, JOSEPH
To: CREE, INC.
Reel/Frame 034600/0490 →
Assignment of Assignor's Interest Feb 6, 2015
From: DONOFRIO, MATTHEW; KAR, PRITISH; HEIKMAN, STEN; GOLAKIA, HARSHAD
To: CREE, INC.
Reel/Frame 034911/0432 →
Assignment of Assignor's Interest Dec 3, 2015
From: MAYER, ERIC; PARK, JAE; BREVA, MANUEL L.
To: CREE, INC.
Reel/Frame 037202/0326 →
Assignment of Assignor's Interest Mar 3, 2017
From: KELLER, BERND; CHITNIS, ASHAY; IBBETSON, JAMES; BATRES, MAX
To: CREE, INC.
Reel/Frame 041464/0647 →
Assignment of Assignor's Interest Jun 19, 2018
From: LEUNG, MICHAEL S.; TARSA, ERIC; IBBETSON, JAMES
To: CREE, INC.
Reel/Frame 046127/0792 →
Assignment of Assignor's Interest Jul 9, 2018
From: REIHERZER, JESSE; NEVINS, JEREMY; CLARK, JOSEPH
To: CREE, INC.
Reel/Frame 046298/0060 →
Security Interest Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001 Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →