IP Library Assignment 032057/0101
Patent Assignment
Reel/Frame 032057/0101

Assignment of Assignor's Interest

Recorded: 2013-12-10 Pages: 8
Assignors
HEIKMAN, STEN
Executed: 2013-10-18
IBBETSON, JAMES
Executed: 2013-10-29
YAO, ZHIMIN JAMIE
Executed: 2013-10-20
ZHANG, FAN
Executed: 2013-10-28
DONOFRIO, MATTHEW
Executed: 2013-10-16
HUSSELL, CHRISTOPHER P.
Executed: 2013-10-15
EDMOND, JOHN A.
Executed: 2013-12-10
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property (1)
Chip with Integrated Phosphor
Application: 14/053,404 →
Publication: US 2014/0217443
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 5, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 056137/0452 →
Security Interest Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001 Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →