Granted Patent B2

US 9,414,524 · App. 14/023,521 · Granted Aug 9, 2016

Abstract

Claims (32)

1. A circuit board assembly, comprising:

a first mounting frame portion of a first size having a PCB mounted thereto;

a second mounting frame portion connected to the first mounting frame portion having no portion of the PCB connected thereto, a combination size of the first and second mounting frames defining a larger second size;

a third mounting frame portion connected to the second mounting frame portion and having no portion of the PCB connected thereto, the third mounting frame portion extending longitudinally from the second mounting frame portion; and

at least one heat transfer component connected to the first or second mounting frame portion creating a conduction/convection cooling path;

wherein the first mounting frame portion includes a first false board edge, and the second mounting frame portion includes at least one false board edge positioned laterally and opposite with respect to the first false board edge.

2. The circuit board assembly of claim 1 , wherein the first size equates to a 3U OVPX panel.

3. The circuit board assembly of claim 2 , wherein the second size equates to a 6U OVPX panel.

4. The circuit board assembly of claim 1 , further including a plurality of heat transfer components connected to the third mounting frame portion.

5. The circuit board assembly of claim 1 , wherein the at least one heat transfer component comprises multiple cooling fins.

6. The circuit board assembly of claim 1 , further including first and second support wings connected to the second mounting frame portion.

7. The circuit board assembly of claim 1 , wherein the second mounting frame portion is an integral extension of the first mounting frame portion.

8. A circuit board assembly for installation in a cabinet, comprising:

a first mounting frame portion of a first size having a PCB mounted thereto;

a second mounting frame portion connected to the first mounting frame portion having no portion of the PCB connected thereto, a combination size of the first and second mounting frames defining a larger second size, wherein the second mounting frame portion is positioned above the PCB when the circuit board assembly is mounted in the cabinet thereby providing a conductive heat transfer path to a cabinet first wall;

multiple heat transfer components connected to the second mounting frame portion providing a conduction/convection cooling path away from the first mounting frame portion for removing heat generated by the PCB via the second mounting frame portion; and

the first mounting frame portion that includes a first false board edge, and the second mounting frame portion that includes one or more false board edges positioned laterally and oppositely directed with respect to the first false board edge, the first and second false board edges being slidably received in opposed slots created in a cabinet.

9. The circuit board assembly of claim 8 , wherein the heat transfer components are configured in an assembly having multiple rows of the heat transfer components.

10. The circuit board assembly of claim 9 , wherein the assembly includes the heat transfer components configured in at least first, second, third, fourth and fifth rows extending in a lateral direction with respect to the PCB.

11. The circuit board assembly of claim 8 , further including a heat frame in contact with the PCB wherein heat generated by electrical components of the PCB is conductively transferred away from the PCB via the heat frame in addition to the second mounting frame portion.

12. An electronic cabinet system, comprising:

a cabinet having a first board slot created in a cabinet first wall and a second board slot created in a cabinet second wall;

a circuit board assembly, including:

a first mounting frame portion of a first standards based circuit board size having a PCB mounted thereto;

a second mounting frame portion connected to the first mounting frame portion having no portion of the PCB connected thereto, a combination size of the first and second mounting frames defining a larger second circuit board size;

a third mounting frame portion connected to the second mounting frame portion and extending in a lateral direction with respect to the PCB;

at least one heat transfer component connected to the second mounting frame portion providing a conduction/convection cooling path away from the first mounting frame portion for removing heat generated by the PCB via the second mounting frame portion; and

the first mounting frame portion including a first false board edge slidably received in the first board slot and the second mounting frame portion including a second false board edge positioned laterally and oppositely directed with respect to the first false board edge, the second false board edge slidably received in the second board slot.

13. The electronic cabinet system of claim 12 , wherein the second mounting frame portion is positioned above the first mounting frame portion when the circuit board assembly is mounted in the cabinet to provide for heat transfer into the second mounting frame portion.

14. The electronic cabinet system of claim 12 , wherein an assembly of the heat transfer components includes multiple rows of heat transfer components configured in at least first, second, third, fourth and fifth rows.

15. The electronic cabinet system of claim 12 , wherein an assembly of the heat transfer components includes multiple rows of heat transfer components configured in at least first, second and third rows.

16. The electronic cabinet system of claim 12 , wherein the third mounting frame portion is positioned in a different cabinet area than the first and second mounting frame portions.

Assignments (15)