Binder materials for light-emitting devices
Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly binder materials for light-emitting devices are disclosed. A lumiphoric material for a light-emitting device may include lumiphoric particles embedded within a binder material. The lumiphoric material may be formed according to sol-gel chemistry techniques where a solution of binder precursors and lumiphoric particles is applied to a surface, dried to reduce liquid phase, and fired to form a hardened and dense lumiphoric material. The binder precursors may include metal oxide precursors that result in a metal oxide binder. In this manner, the lumiphoric material may have high thermal conductivity while also being adaptable for liquid-phase processing. In further embodiments, binder materials with or without lumiphoric particles may be utilized in place of conventional encapsulation materials for light-emitting devices.
1. A light-emitting device comprising:
a light-emitting diode (LED) chip; and
a lumiphoric material arranged to receive light emitted by the LED chip, the lumiphoric material comprising a plurality of lumiphoric particles in a binder, the lumiphoric material comprising a density of at least 1.8 grams per centimeter cubed (g/cm 3 ) and a weight percentage of lumiphoric particles that is at least 70%;
wherein the lumiphoric material comprises a first face and a second face that opposes the first face, wherein the plurality of lumiphoric particles are provided in a settled arrangement within the binder such that a highest concentration of the lumiphoric particles is in a region of the binder that is adjacent the second face.
2. The light-emitting device of claim 1 , wherein the binder comprises a metal oxide binder.
3. The light-emitting device of claim 2 , wherein the metal oxide binder comprises tin (Sn).
4. The light-emitting device of claim 2 , wherein the metal oxide binder comprises aluminum (Al).
5. The light-emitting device of claim 1 , wherein the density is in a range from 1.8 g/cm 3 to 10 g/cm 3 .
6. The light-emitting device of claim 1 , wherein the weight percentage of lumiphoric particles is at least 90%.
7. The light-emitting device of claim 1 , wherein the lumiphoric material comprises a thermal conductivity in a range from 10 watts per meter per Kelvin (W/(m·K)) to 50 W/(m·K).
8. The light-emitting device of claim 1 , wherein the lumiphoric material forms a nonplanar shape.
9. The light-emitting device of claim 8 , wherein the nonplanar shape comprises a lens with a curved upper surface.
10. The light-emitting device of claim 1 , wherein the plurality of lumiphoric particles are provided within the binder such that a region of the binder that is adjacent the first face is devoid of the plurality of lumiphoric particles.
11. The light-emitting device of claim 10 , wherein the region of the binder that is devoid of the plurality of lumiphoric particles comprises a thickness in a range from 5 μm to 15 μm as measured from the first face.
12. The light-emitting device of claim 1 , wherein the plurality of lumiphoric particles comprises a first distribution of lumiphoric particles and a second distribution of lumiphoric particles and the first distribution of lumiphoric particles is configured to provide a different wavelength of light emissions than the second distribution of lumiphoric particles.
13. The light-emitting device of claim 12 , wherein the first distribution of lumiphoric particles and the second distribution of lumiphoric particles are mixed together in the binder.
14. The light-emitting device of claim 12 , wherein the first distribution of lumiphoric particles and the second distribution of lumiphoric particles are provided in separate layers of the binder.
15. The light-emitting device of claim 1 , wherein the lumiphoric material is provided on a light-transmissive support element.
16. The light-emitting device of claim 15 , further comprising a submount, wherein the LED chip is mounted on the submount and the lumiphoric material is provided on the LED chip and on a surface of the submount that is uncovered by the LED chip.
17. A light-emitting device comprising:
a light-emitting diode (LED) chip; and
a lumiphoric material arranged to receive light emitted by the LED chip, the lumiphoric material comprising a plurality of lumiphoric particles in a binder, the lumiphoric material comprising a thickness of less than 100 microns (μm) and a thermal conductivity in a range from 10 watts per meter per Kelvin (W/(m·K)) to 50 W/(m·K);
wherein the lumiphoric material comprises a first face and a second face that opposes the first face, wherein the plurality of lumiphoric particles are provided in a settled arrangement within the binder such that a highest concentration of the lumiphoric particles is in a region of the binder that is adjacent the second face.
18. The light-emitting device of claim 17 , wherein the binder comprises a metal oxide binder.
19. The light-emitting device of claim 17 , wherein the thickness is in a range from 15 μm to less than 100 μm.
20. The light-emitting device of claim 17 , wherein the plurality of lumiphoric particles are provided within the binder such that a region of the binder that is adjacent the first face is devoid of the plurality of lumiphoric particles.
21. The light-emitting device of claim 20 , wherein the region of the binder that is devoid of the plurality of lumiphoric particles comprises a thickness in a range from 5 μm to 15 μm as measured from the first face.
22. The light-emitting device of claim 17 , wherein the lumiphoric material is provided on a light-transmissive support element.
23. A light-emitting device comprising:
a light-emitting diode (LED) chip; and
an encapsulation material arranged to at least partially encapsulate the LED chip, the encapsulation material comprising a binder with a thermal conductivity in a range from 10 watts per meter per Kelvin (W/(m·K)) to 50 W/(m·K);
wherein the encapsulation material comprises a plurality of lumiphoric particles that are provided in a settled arrangement within the binder such that a highest concentration of the lumiphoric particles is adjacent the LED chip.
24. The light-emitting device of claim 23 , wherein the encapsulation material completely encapsulates the LED chip.
25. The light-emitting device of claim 23 , wherein the binder comprises a metal oxide binder.
26. The light-emitting device of claim 23 , wherein the encapsulation material forms a coating on the LED chip.
27. The light-emitting device of claim 23 , wherein the encapsulation material comprises a plurality of light-scattering particles in the binder.
28. The light-emitting device of claim 27 , wherein the plurality of light-scattering particles is provided in a settled arrangement within the binder such that a highest concentration of the light-scattering particles is adjacent the LED chip.