Bonding of light emitting diodes having shaped substrates
View Patent ↗Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.
1. A method of thermosonically bonding a light emitting diode to a submount, the light emitting diode having a substrate, an active region on the substrate, and a metal pad on the active region opposite the substrate, the method comprising:
placing the metal pad of the light emitting diode in contact with the submount; and
applying force to a planar surface of a substrate of the light emitting diode that is oblique to a direction of thermosonic motion of the light emitting diode while the metal pad is in contact with the submount to thermosonically bond the light emitting diode to the submount.
2. The method of claim 1 , wherein the step of applying force comprises:
mating a collet to the surface of the substrate oblique to the direction of motion; and
moving the collet in the direction of motion.
3. The method of claim 2 , wherein mating a collet comprises seating a collet having a mating surface corresponding to an oblique surface of the substrate so that the mating surface of the collet contacts the oblique surface of the substrate.
4. The method of claim 3 , wherein the mating surface of the collet is a fixed surface relative to a body of the collet.
5. A method of thermosonically bonding a light emitting diode to a submount, comprising:
applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount;
wherein the step of applying force comprises:
mating a collet to the surface of the substrate oblique to the direction of motion; and
moving the collet in the direction of motion;
wherein mating a collet comprises seating a collet having a mating surface corresponding to an oblique surface of the substrate so that the mating surface of the collet contacts the oblique surface of the substrate; and
wherein the mating surface of the collet is a moveable surface relative to a body of the collet.
6. The method of claim 3 , wherein seating the collet comprises:
placing the collet over the light emitting diode; and
applying a vacuum pressure to the collet.
7. The method of claim 1 , wherein the light emitting diode comprises a gallium nitride based light emitting diode having a silicon carbide shaped substrate.
8. The method of claim 7 , wherein the silicon carbide shaped substrate has a cubic portion and a truncated pyramidal portion adjacent the cubic portion and wherein the step of applying force comprises applying force to sidewalls of the truncated pyramidal portion of the silicon carbide substrate.
9. The method of claim 1 , wherein applying force comprises applying force through a collet to the surface of the substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode.
10. The method of claim 1 , wherein applying force comprises applying force through the substrate toward the metal pad to bond the light emitting diode to the submount.
11. The method of claim 1 , wherein applying force comprises applying vibrational force to thermosonically bond the light emitting diode to the submount.