IP Library Granted Patent US 7,394,169
Granted Patent B2
US 7,394,169 · App. 11/287,645 · Granted Jul 1, 2008

Power distribution system

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Quick Facts
Patent No.
US 7,394,169
App. No.
11/287,645
Granted
Jul 1, 2008
Kind
B2
Abstract

A power distribution system and method may include a first power domain having a first plurality of power rails, a second power domain having a second plurality of power rails, where the first power domain is electrically independent of the second power domain, and a plurality of modules coupled to the first power domain and the second power domain, where each of the plurality of modules is coupled to one of the first plurality of power rails and one of the second plurality of power rails. The system may also include a plurality of mated pairs, where each of the plurality of modules is in only one of the plurality of mated pairs, and where each of the plurality of mated pairs is coupled to two separate of the first and second plurality of power rails.

Claims (31)

1. A power distribution system, comprising:

a first power domain having a first plurality of power rails;

a second power domain having a second plurality of power rails, wherein the first power domain is electrically independent of the second power domain;

a plurality of modules coupled to the first power domain and the second power domain, wherein each of the plurality of modules is coupled to one of the first plurality of power rails and one of the second plurality of power rails; and

a plurality of mated pairs, wherein each of the plurality of modules is in only one of the plurality of mated pairs, wherein each of the plurality of mated pairs is coupled to two separate of the first and second plurality of power rails.

2. The power distribution system of claim 1 , wherein a module in a mated pair is operationally redundant with a corresponding module in the mated pair.

3. The power distribution system of claim 2 , wherein the module and the corresponding module are at least one of a payload module and a switch module.

4. The power distribution system of claim 1 , wherein the plurality of modules are one of ATCA and CPCI modules.

5. The power distribution system of claim 1 , wherein the first and second plurality of power rails reside substantially in a backplane.

6. The power distribution system of claim 1 , wherein the first and second plurality of power rails have a DC voltage.

7. An embedded computer chassis having a backplane, the embedded computer chassis comprising:

a first plurality of power rails residing substantially in the backplane;

a second plurality of power rails residing substantially in the backplane, wherein the first plurality of power rails is electrically independent of the second plurality of power rails;

a plurality of slots coupled to one of the first plurality of power rails and one of the second plurality of power rails; and

a plurality of mated pairs, wherein each of the plurality of slots is in only one of the plurality of mated pairs, wherein each of the plurality of mated pairs is coupled to two separate of the first and second plurality of power rails.

8. The embedded computer chassis of claim 7 , wherein each of the plurality of slots is coupled to receive a module.

9. The embedded computer chassis of claim 7 , wherein each of the plurality of slots in a mated pair is coupled to receive a module which is operationally redundant with a corresponding module coupled to the mated pair.

10. The embedded computer chassis of claim 9 , wherein the module and the corresponding module are at least one of a payload module and a switch module.

11. The embedded computer chassis of claim 7 , wherein the embedded computer chassis is one of an ATCA and CPCI embedded computer chassis.

12. The embedded computer chassis of claim 7 , wherein the first and second plurality of power rails have a DC voltage.

13. A method of distributing power in an embedded computer chassis, comprising:

providing a first plurality of power rails residing substantially in a backplane;

providing a second plurality of power rails residing substantially in the backplane, wherein the first plurality of power rails is electrically independent of the second plurality of power rails;

providing a plurality of slots coupled to one of the first plurality of power rails and one of the second plurality of power rails;

providing a plurality of mated pairs, wherein each of the plurality of slots is in only one of the plurality of mated pairs; and

coupling each of the plurality of mated pairs to two separate of the first and second plurality of power rails.

14. The method of claim 13 , wherein each of the plurality of slots is coupled to receive a module.

15. The method of claim 13 , further comprising coupling each of the plurality of slots in a mated pair to receive a module which is operationally redundant with a corresponding module coupled to the mated pair.

16. The method of claim 15 , wherein the module and the corresponding module are at least one of a payload module and a switch module.

17. The method of claim 13 , wherein the embedded computer chassis is one of an ATCA and CPCI embedded computer chassis.

18. The method of claim 13 , further comprising the first and second plurality of power rails having a DC voltage.

Assignments (9)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
CHANGE OF NAME Recorded Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →