IP Library Granted Patent US 7,646,035
Granted Patent B2
US 7,646,035 · App. 11/443,741 · Granted Jan 12, 2010

Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices

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Quick Facts
Patent No.
US 7,646,035
App. No.
11/443,741
Granted
Jan 12, 2010
Kind
B2
Abstract

A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.

Claims (30)

1. A packaged light emitting device, comprising:

a substrate;

a solid state light emitting device on the substrate;

a first lens on the substrate and defining a cavity and having a first index of refraction; and

a second lens positioned at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction;

wherein the first lens comprises a molded lens, and wherein the second index of refraction is higher than the first index of refraction;

wherein the first lens comprises a convex mating surface on an inside surface of the first lens and the second lens comprises a concave mating surface on an outside surface of the second lens, wherein the convex mating surface of the first lens matches a shape of the concave mating surface of the second lens.

2. The packaged light emitting device of claim 1 , further comprising an encapsulant material between the solid state light emitting device and the second lens.

3. The packaged light emitting device of claim 1 , wherein the substrate comprises a leadframe or a printed circuit board, wherein the packaged light emitting device further comprises a molded body on the substrate, and wherein the first lens is on the molded body.

4. The packaged light emitting device of claim 3 , wherein the molded body includes at least one surface that extends along a surface of the substrate and at least one vertical sidewall extending from the surface and defining a mounting location for the first lens.

5. The packaged light emitting device of claim 3 , wherein the molded body extends at least partially through the leadframe.

6. The packaged light emitting device of claim 1 , wherein the first lens includes a first mating surface and the second lens includes a second mating surface that is in contact with the first mating surface of the first lens.

7. The packaged light emitting device of claim 1 , wherein the second lens is attached to the first lens using an adhesive encapsulant.

8. The packaged light emitting device of claim 7 , wherein the adhesive encapsulant has an index of refraction that is substantially the same as the first index of refraction or the second index of refraction.

9. The packaged light emitting device of claim 1 , further comprising a third lens positioned on the second lens and having a third index of refraction.

10. The packaged light emitting device of claim 9 , wherein the third index of refraction is higher than the first index of refraction.

11. The packaged light emitting device of claim 10 , wherein the third index of refraction is higher than the second index of refraction.

12. The packaged light emitting device of claim 10 , wherein the third index of refraction is higher than the first index of refraction and is the same as the second index of refraction.

13. A solid state luminaire comprising a packaged light emitting device as recited in claim 1 .

14. A backlight panel for a display comprising a packaged light emitting device as recited in claim 1 .

15. The packaged light emitting device of claim 1 , wherein both the first lens and the second lens comprise silicone.

16. A lens for a packaged light emitting device, comprising:

a generally toroidal side lens defining a cavity therein and having a first index of refraction and including a convex mating surface on an inside surface of the side lens; and

a core lens positioned at least partially within the cavity formed by the side lens and having a second index of refraction that is different from the first index of refraction and having a concave mating surface on an outside surface of the core lens, wherein the convex mating surface of the side lens matches a shape of the concave mating surface of the core lens.

17. The lens of claim 16 , wherein the second index of refraction is higher than the first index of refraction.

18. The lens of claim 16 , further comprising a third lens positioned on the second lens and having a third index of refraction.

19. The lens of claim 18 , wherein the third index of refraction is higher than the first index of refraction.

20. The lens of claim 19 , wherein the third index of refraction is higher than the second index of refraction.

21. The lens of claim 19 , wherein the third index of refraction is higher than the first index of refraction and is the same as the second index of refraction.

22. The lens of claim 16 , wherein both the side lens and the core lens comprise molded silicone.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2006
From: LOH, BAN P.; MEDENDORP, NICHOLAS W., JR.; KELLER, BERND
To: CREE, INC.
Reel/Frame 018168/0678 →