3U payload module configurations
View Patent ↗A multi-service platform system ( 100, 200, 300, 400 ) includes a computer chassis ( 101, 201, 301, 401 ) having a plurality of 3U slots ( 205 ), a backplane ( 104 ) integrated in the computer chassis, a switched fabric ( 106 ) on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module ( 102 ) having a 3U form factor is coupled to interface with one of the plurality of 3U slots, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector ( 118 ) is coupled to a rear edge ( 119 ) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
1. A multi-service platform system, comprising:
a 3U computer chassis having a plurality of 3U slots;
a backplane integrated in the 3U computer chassis;
a switched fabric on the backplane;
at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;
a payload module having a 3U form factor, wherein the payload module is coupled to interface with one of the plurality of 3U slots, and wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network; and
at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
2. The multi-service platform system of claim 1 , wherein communication between the backplane and the payload module occur exclusively through the at least one multi-gigabit connector.
3. The multi-service platform system of claim 1 , wherein the at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.
4. The multi-service platform system of claim 1 , wherein the at least one multi-gigabit connector is coupled to interface with at least one corresponding multi-gigabit connector on the backplane.
5. The multi-service platform system of claim 1 , further comprising a switch module having a 3U form factor, wherein the switch module is coupled to the backplane through the at least one of the plurality of 3U slots.
6. The multi-service platform system of claim 1 , wherein the payload module is horizontally disposed in the 3U computer chassis.
7. The multi-service platform system of claim 1 , further comprising a switch module having a 3U form factor, wherein the switch module is coupled to the backplane through the at least one of the plurality of 3U slots, and wherein the payload module and the switch module are horizontally disposed in the 3U computer chassis.
8. A multi-service platform system, comprising:
a 6U computer chassis having a plurality of 3U slots;
a backplane integrated in the 6U computer chassis;
a switched fabric on the backplane;
at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;
a payload module having a 3U form factor, wherein the payload module is coupled to interface with one of the plurality of 3U slots, and wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network; and
at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
9. The multi-service platform system of claim 8 , wherein communication between the backplane and the payload module occur exclusively through the at least one multi-gigabit connector.
10. The multi-service platform system of claim 8 , wherein the at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.
11. The multi-service platform system of claim 8 , wherein the at least one multi-gigabit connector is coupled to interface with at least one corresponding multi-gigabit connector on the backplane.
12. The multi-service platform system of claim 8 , further comprising a switch module having a 6U form factor, wherein the 6U computer chassis comprises at least one 6U slot, and wherein the switch module is coupled to the backplane through the at least one of the plurality of 6U slots.
13. The multi-service platform system of claim 12 , wherein the 6U computer chassis comprises a modular bay, wherein the modular bay is coupled to receive at least one of a power supply module and a drive module.
14. The multi-service platform system of claim 8 , wherein the 6U computer chassis comprises a modular bay, wherein the modular bay is coupled to receive at least one of a power supply module and a drive module.
15. The multi-service platform system of claim 8 , further comprising a switch module having a 3U form factor, wherein the switch module is coupled to the backplane through the at least one of the plurality of 3U slots.
16. A multi-service platform system, comprising:
a computer chassis having a plurality of horizontally disposed 3U slots;
a backplane integrated in the computer chassis;
a switched fabric on the backplane;
at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;
a payload module having a 3U form factor, wherein the payload module is coupled to interface with one of the plurality of horizontally disposed 3U slots, and wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network; and
at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
17. The multi-service platform system of claim 16 , wherein communication between the backplane and the payload module occur exclusively through the at least one multi-gigabit connector.
18. The multi-service platform system of claim 16 , wherein the at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.
19. The multi-service platform system of claim 16 , wherein the at least one multi-gigabit connector is coupled to interface with at least one corresponding multi-gigabit connector on the backplane.
20. The multi-service platform system of claim 16 , further comprising a switch module having a 3U form factor, wherein the switch module is coupled to the backplane through the at least one of the plurality of horizontally disposed 3U slots.
21. The multi-service platform system of claim 16 , further comprising a switch module having a 6U form factor, wherein the computer chassis comprises at least one horizontally disposed 6U slot, and wherein the switch module is coupled to the backplane through the at least one horizontally disposed 6U slot.
22. The multi-service platform system of claim 16 , wherein the computer chassis comprises a modular bay, wherein the modular bay is coupled to receive at least one of a power supply module and a drive module.