Multi-network modules with hot-swap capability
View Patent ↗A payload module ( 202 ) includes a payload subunit ( 212 ) coupled to the payload module, where the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor. At least one multi-gigabit connector ( 218 ) is coupled to a rear edge ( 219 ) of the payload module and to the payload subunit, where the at least one multi-gigabit connector is coupled to communicatively interface the payload subunit to a backplane ( 204 ), where the backplane includes a switched fabric ( 206 ) coincident with at least one of a VMEbus network and a PCI network, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload subunit through the at least one multi-gigabit connector. A payload module power connector ( 242 ) includes a plurality of pins ( 243 ), where at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between a main power bus ( 207 ) on the backplane and a payload module power bus ( 240 ) on the payload module is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period ( 302, 304 ), where power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the payload module power bus.
1. A multi-service platform system, comprising:
a backplane having a main power bus, wherein the backplane is coupled to operate a switched fabric coincident with at least one of a VMEbus network and a PCI network;
a payload module having one of a 3U form factor, a 6U form factor and a 9U form factor, wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network, wherein the payload module includes a payload module power bus that is adapted to be electrically coupled to the main power bus;
at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector; and
a payload module power connector comprising a plurality of pins, wherein at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between the main power bus and the payload module power bus is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period, and wherein power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the payload module power bus.
2. The multi-service platform system of claim 1 , further comprising a power control module coupled to payload module, wherein the power control module is coupled to control application of power between the main power bus and the payload module power bus in a smooth and gradually ramped fashion over a time period when payload module power connector is coupled to the backplane.
3. The multi-service platform system of claim 1 , further comprising a power control module coupled to payload module, wherein the power control module is coupled to control removal of power between the main power bus and the payload module power bus in a smooth and gradually ramped fashion over a time period when payload module power connector is decoupled from the backplane.
4. The multi-service platform system of claim 1 , wherein the payload module power connector is coextensive with the at least one multi-gigabit connector on the rear edge of the payload module.
5. A multi-service platform system, comprising:
a backplane having a main power bus, wherein the backplane is coupled to operate a switched fabric coincident with at least one of a VMEbus network and a PCI network;
a switch module having one of a 3U form factor and a 9U form factor; wherein the switch module includes a central switching resource coupled to operate the switched fabric, wherein the switch module includes a switch module power bus that is adapted to be electrically coupled to the main power bus; and
a switch module power connector comprising a plurality of pins, wherein at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between the main power bus and the switch module power bus is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period, and wherein power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the switch module power bus.
6. The multi-service platform system of claim 5 , further comprising a power control module coupled to switch module, wherein the power control module is coupled to control application of power between the main power bus and the switch module power bus in a smooth and gradually ramped fashion over a time period when switch module power connector is coupled to the backplane.
7. The multi-service platform system of claim 5 , further comprising a power control module coupled to switch module, wherein the power control module is coupled to control removal of power between the main power bus and the switch module power bus in a smooth and gradually ramped fashion over a time period when switch module power connector is decoupled from the backplane.
8. The multi-service platform system of claim 5 , wherein the switch module is coupled to interface with the switched fabric and at least one of the VMEbus network and the PCI network.
9. A payload module, comprising:
a payload subunit coupled to the payload module, wherein the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor;
at least one multi-gigabit connector coupled to a rear edge of the payload module and to the payload subunit, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload subunit to a backplane, wherein the backplane includes a switched fabric coincident with at least one of a VMEbus network and a PCI network, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload subunit through the at least one multi-gigabit connector; and
a payload module power connector comprising a plurality of pins, wherein at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between a main power bus on the backplane and a payload module power bus on the payload module is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period, and wherein power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the payload module power bus.
10. The payload module of claim 9 , further comprising a power control module coupled to payload module, wherein the power control module is coupled to control application of power between the main power bus and the payload module power bus in a smooth and gradually ramped fashion over a time period when payload module power connector is coupled to the backplane.
11. The payload module of claim 9 , further comprising a power control module coupled to payload module, wherein the power control module is coupled to control removal of power between the main power bus and the payload module power bus in a smooth and gradually ramped fashion over a time period when payload module power connector is decoupled from the backplane.
12. The payload module of claim 9 , wherein the payload module power connector is coextensive with the at least one multi-gigabit connector on the rear edge of the payload module.
13. A switch module, comprising:
a board having one of a 3U form factor and a 9U form factor;
a central switching resource coupled to the board, wherein the central switching resource is coupled to operate a switched fabric on a backplane, wherein the switched fabric operates coincident with at least one of a VMEbus network and a PCI network on the backplane; and
a switch module power connector comprising a plurality of pins, wherein at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between a main power bus on the backplane and a switch module power bus on the switch module is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period, and wherein power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the switch module power bus.
14. The switch module of claim 13 , further comprising a power control module coupled to switch module, wherein the power control module is coupled to control application of power between the main power bus and the switch module power bus in a smooth and gradually ramped fashion over a time period when switch module power connector is coupled to the backplane.
15. The switch module of claim 13 , further comprising a power control module coupled to switch module, wherein the power control module is coupled to control removal of power between the main power bus and the switch module power bus in a smooth and gradually ramped fashion over a time period when switch module power connector is decoupled from the backplane.
16. The switch module of claim 13 , wherein the switch module is coupled to interface with the switched fabric and at least one of the VMEbus network and the PCI network.