Integrated power supply and air inlet unit
View Patent ↗An integrated power supply air inlet unit ( 124 ) coupled to slidably insert into a first interspace region ( 120 ) of an embedded computer chassis ( 100 ), where the first interspace region is defined by a module portion ( 102 ), a rear surface ( 110 ) and a first side surface ( 112 ), includes a power supply ( 128 ) coupled to supply power to the embedded computer chassis, and a front surface ( 130 ) that is substantially perpendicular to the first side surface. A cooling air mass ( 140 ) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular ( 150 ) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.
1. An embedded computer chassis, comprising:
a plurality of outer surfaces comprising a rear surface, a first side surface and a second side surface, wherein the rear surface is substantially perpendicular to the first side surface and the second side surface;
a module portion, comprising:
a backplane disposed substantially vertically within the embedded computer chassis, wherein the backplane is substantially parallel to the rear surface;
a front module coupled to a front portion of the backplane, wherein the front module is substantially horizontally disposed; and
a rear module coupled to a rear portion of the backplane, wherein the rear module is substantially horizontally disposed;
a first interspace region defined by the module portion, the first side surface and the rear surface;
a second interspace region defined by the module portion, the second side surface and the rear surface;
an integrated power supply air inlet unit coupled to slidably insert into the first interspace region, wherein the integrated power supply air inlet unit couples to the backplane, and wherein the integrated power supply air inlet unit further comprises:
a power supply coupled to supply power to the embedded computer chassis; and
a front surface that is substantially perpendicular to the first side surface, wherein a cooling air mass is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular to the front surface; and
an air-moving unit coupled to slidably insert into the second interspace region, wherein the air-moving unit is coupled to draw the cooling air mass over the front module in a direction substantially parallel to the backplane, and wherein the air-moving unit is coupled to push a first portion of the cooling air mass over the rear module in a substantially opposite direction substantially parallel to the backplane.
2. The embedded computer chassis of claim 1 , wherein the integrated power supply air inlet unit is hot-swappable.
3. The embedded computer chassis of claim 1 , wherein the air-moving unit is hot-swappable.
4. The embedded computer chassis of claim 1 , wherein the embedded computer chassis is coupled to exhaust a second portion of the cooling air mass through a first portion of the rear surface in a direction substantially perpendicular to the rear surface.
5. The embedded computer chassis of claim 4 , wherein the embedded computer chassis is coupled to exhaust the first portion of the cooling air mass through a second portion of the rear surface in a direction substantially perpendicular to the rear surface.
6. The embedded computer chassis of claim 5 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is between 0.5:2.0 and 2.0:0.5.
7. The embedded computer chassis of claim 5 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is substantially 1:1.
8. An integrated power supply air inlet unit coupled to slidably insert into a first interspace region of an embedded computer chassis, wherein the first interspace region is defined by a module portion, a rear surface and a first side surface, comprising:
a power supply coupled to supply power to the embedded computer chassis; and
a front surface that is substantially perpendicular to the first side surface, wherein a cooling air mass is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular to the front surface, wherein upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and wherein the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.
9. An embedded computer chassis, comprising:
a plurality of outer surfaces comprising a rear surface, a first side surface and a second side surface, wherein the rear surface is substantially perpendicular to the first side surface and the second side surface;
a module portion, comprising:
a backplane disposed substantially vertically within the embedded computer chassis, wherein the backplane is substantially parallel to the rear surface;
a front module coupled to a front portion of the backplane, wherein the front module is substantially horizontally disposed; and
a rear module coupled to a rear portion of the backplane, wherein the rear module is substantially horizontally disposed;
a first interspace region defined by the module portion, the first side surface and the rear surface, wherein the first interspace region is coupled to receive an integrated power supply air inlet unit, wherein the integrated power supply air inlet unit is coupled to supply power to the embedded computer chassis, and wherein the integrated power supply air inlet unit comprises a front surface that is substantially perpendicular to the first side surface, wherein a cooling air mass is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular to the front surface; and
a second interspace region defined by the module portion, the second side surface and the rear surface, wherein the second interspace region is coupled to receive an air-moving unit, wherein the air-moving unit is coupled to draw the cooling air mass over the front module in a direction substantially parallel to the backplane, and wherein the air-moving unit is coupled to push a first portion of the cooling air mass over the rear module in a substantially opposite direction substantially parallel to the backplane.
10. The embedded computer chassis of claim 9 , wherein the integrated power supply air inlet unit is hot-swappable.
11. The embedded computer chassis of claim 9 , wherein the air-moving unit is hot-swappable.
12. The embedded computer chassis of claim 9 , wherein the embedded computer chassis is coupled to exhaust a second portion of the cooling air mass through a first portion of the rear surface in a direction substantially perpendicular to the rear surface.
13. The embedded computer chassis of claim 12 , wherein the embedded computer chassis is coupled to exhaust the first portion of the cooling air mass through a second portion of the rear surface in a direction substantially perpendicular to the rear surface.
14. The embedded computer chassis of claim 13 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is between 0.5:2.0 and 2.0:0.5.
15. The embedded computer chassis of claim 13 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is substantially 1:1.
16. A method of cooling an embedded computer chassis, comprising:
providing the embedded computer chassis including a plurality of outer surfaces comprising a rear surface, a first side surface and a second side surface, wherein the rear surface is substantially perpendicular to the first side surface and the second side surface;
providing a module portion, comprising:
a backplane disposed substantially horizontally within the embedded computer chassis, wherein the backplane is substantially parallel to the rear surface;
a front module coupled to a front portion of the backplane, wherein the front module is substantially horizontally disposed; and
a rear module coupled to a rear portion of the backplane, wherein the rear module is substantially horizontally disposed;
providing a first interspace region defined by the module portion, the first side surface and the rear surface, wherein the first interspace region is coupled to receive an integrated power supply air inlet unit;
providing the integrated power supply air inlet unit supplying power to the embedded computer chassis;
drawing a cooling air mass into the embedded computer chassis through a front surface of the integrated power supply air inlet unit in a direction substantially perpendicular to the front surface;
providing a second interspace region defined by the module portion, the second side surface and the rear surface, wherein the second interspace region is coupled to receive an air-moving unit;
wherein the air-moving unit drawing the cooling air mass over the front module in a direction substantially parallel to the backplane; and
wherein the air-moving unit pushing a first portion of the cooling air mass over the rear module in a substantially opposite direction substantially parallel to the backplane.
17. The method of claim 16 , wherein the integrated power supply air inlet unit is hot-swappable.
18. The method of claim 16 , wherein the air-moving unit is hot-swappable.
19. The method of claim 16 , further comprising exhausting a second portion of the cooling air mass through a first portion of the rear surface in a direction substantially perpendicular to the rear surface.
20. The method of claim 19 , further comprising exhausting the first portion of the cooling air mass through a second portion of the rear surface in a direction substantially perpendicular to the rear surface.
21. The method of claim 20 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is between 0.5:2.0 and 2.0:0.5.
22. The method of claim 20 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is substantially 1:1.
23. A method of cooling a module portion of an embedded computer chassis, providing the module portion comprises a front module coupled to a front portion of a backplane, and a rear module coupled to a rear portion of the backplane, wherein the front module and the rear module are horizontally disposed, the method comprising:
providing a first interspace region coupled to receive an integrated power supply air inlet unit;
providing the integrated power supply air inlet unit supplying power to the embedded computer chassis;
drawing a cooling air mass into the embedded computer chassis through a front surface of the integrated power supply air inlet unit in a direction substantially perpendicular to the front surface;
providing a second interspace region coupled to receive an air-moving unit;
wherein the air-moving unit drawing the cooling air mass over the front module in a direction substantially parallel to the front surface; and
wherein the air-moving unit pushing a first portion of the cooling air mass over the rear module in a substantially opposite direction substantially parallel to the front surface.
24. The method of claim 23 , further comprising exhausting a second portion of the cooling air mass through a first portion of a rear surface in a direction substantially perpendicular to the rear surface.
25. The method of claim 24 , further comprising exhausting the first portion of the cooling air mass through a second portion of the rear surface in a direction substantially perpendicular to the rear surface.
26. The method of claim 25 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is between 0.5:2.0 and 2.0:0.5.
27. The method of claim 25 , wherein a ratio of the first portion of the rear surface to the second portion of the rear surface is substantially 1:1.