Substrate based light emitter devices, components, and related methods
Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.
1. A light emitting diode (LED) apparatus, comprising:
a substrate having an upper surface;
one or more LED disposed over the substrate;
a light-transmissive encapsulant disposed over the one or more LED;
at least one or more scribe mark penetrating the light-transmissive encapsulant from an upper surface of the encapsulant to the upper surface of the substrate, and extending into at least a portion of the substrate; and
a reflective material disposed in at least a portion of the at least one or more scribe mark, wherein the reflective material comprises a first layer of reflective material coating inner walls of the scribe mark, wherein the reflective material comprises a second layer of reflective material applied inside and/or adjacent to the first layer, wherein the reflective material is a different material than the light-transmissive encapsulant,
wherein the at least one or more scribe mark forms a recessed ledge below the upper surface of the substrate, wherein the first layer of reflective material is disposed on the recessed ledge below the upper surface of the substrate, wherein the second layer of reflective material is adjacent to the first layer of reflective material disposed on the recessed ledge.
2. The LED apparatus of claim 1 , wherein the scribe mark comprises substantially beveled or tapered side walls.
3. The LED apparatus of claim 1 , wherein the scribe mark is in a form of a V-shaped trench.
4. The LED apparatus of claim 1 , wherein the scribe mark comprises substantially straight side walls.
5. The LED apparatus of claim 1 , wherein the scribe mark comprises substantially parallel side walls.
6. The LED apparatus of claim 1 , comprising a plurality of LEDs.
7. The LED apparatus of claim 6 , wherein the plurality of LEDs are arranged in a linear array, wherein the at least one or more scribe mark is formed between each of the plurality of LEDs arranged in the linear array.
8. A method producing a light emitting diode (LED) apparatus, the method comprising:
providing a substrate;
providing at least one LED disposed over the substrate;
applying an encapsulant over the at least one LED;
removing material from a top surface of the encapsulant to create at least one or more scribe mark in the encapsulant and extending into at least a portion of the substrate, wherein the at least one or more scribe mark forms a recessed ledge on the substrate; and
disposing a reflective material in at least a portion of the at least one or more scribe mark, wherein the reflective material comprises a first layer of reflective material coating inner walls of the scribe mark, wherein the reflective material comprises a second layer of reflective material applied inside and/or adjacent to the first layer, wherein the reflective material is a different material than the encapsulant, wherein the at least one or more scribe mark forms a recessed ledge below the upper surface of the substrate, wherein the first layer of reflective material is disposed on the recessed ledge below the upper surface of the substrate, wherein the second layer of reflective material is adjacent to the first layer of reflective material disposed on the recessed ledge.
9. The method of claim 8 , wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with substantially beveled or tapered side walls.
10. The method of claim 8 , wherein removing material from the top surface of the encapsulant comprises creating the scribe mark in a form of a V-shaped trench.
11. The method of claim 8 , wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with substantially straight side walls.
12. The method of claim 8 , wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with substantially parallel side walls.
13. The method of claim 8 , wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with a depth that extends to a level above a top surface of the LED.