IP Library Granted Patent US 7,532,616
Granted Patent B2
US 7,532,616 · App. 10/947,970 · Granted May 12, 2009

Fabric enabled storage module

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Quick Facts
Patent No.
US 7,532,616
App. No.
10/947,970
Granted
May 12, 2009
Kind
B2
Abstract

A multi-service platform system, includes a backplane ( 104 ), a switched fabric ( 106 ) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module ( 102 ) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector ( 118 ) is coupled to a rear edge ( 119 ) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. A storage module ( 112, 113 ) is coupled to the payload module, where the storage module is coupled to communicate with the switched fabric.

Claims (49)

1. A multi-service platform system, comprising:

a backplane;

a switched fabric on the backplane;

at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;

a payload module having one of a 3U form factor, a 6U form factor and a 9U form factor, wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network;

at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector; and

a storage module coupled to the payload module, wherein the storage module is coupled to communicate with the switched fabric.

2. The multi-service platform system of claim 1 , wherein communication between the backplane and the payload module occur exclusively through the at least one multi-gigabit connector.

3. The multi-service platform system of claim 1 , wherein at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.

4. The multi-service platform system of claim 1 , further comprising a fabric-to-storage bridge module coupled to the payload module, wherein the fabric-to-storage bridge module is coupled to interface the storage module to the switched fabric.

5. The multi-service platform system of claim 1 , wherein the storage module operates using one of SCSI, IDE/ATA, EIDE, Fibrechannel and ISCSI storage protocols.

6. The multi-service platform system of claim 1 , wherein the switched fabric comprises a first switched fabric and a second switched fabric, and wherein the storage module is coupled to store data communicated from at least one of the first switched fabric and the second switched fabric.

7. The multi-service platform system of claim 1 , wherein the storage module is coupled to communicate with at least one of the VMEbus network and the PCI network.

8. The multi-service platform system of claim 1 , wherein the rear edge of the payload module excludes a legacy connector.

9. A multi-service platform system, comprising:

a backplane;

a switched fabric on the backplane;

at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;

a payload module having one of a 3U form factor, a 6U form factor and a 9U form factor, wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network;

at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector;

a first storage module coupled to the payload module, wherein the first storage module is coupled to communicate with the switched fabric; and

a second storage module coupled to the payload module, wherein the second storage module is coupled to communicate with the switched fabric.

10. The multi-service platform system of claim 9 , further comprising a fabric-to-storage bridge module coupled to the payload module, wherein the fabric-to-storage bridge module is coupled to interface at least one of the first storage module and the second storage module to the switched fabric.

11. The multi-service platform system of claim 9 , further comprising a fabric switch coupled to the payload module, wherein the fabric switch is coupled to selectively communicate data between the switched fabric and one of the first storage module and the second storage module.

12. The multi-service platform system of claim 11 , wherein the switched fabric comprises a first switched fabric and a second switched fabric, and wherein the fabric switch communicatively couples one of the first storage module and the second storage module to one of the first switched fabric and the second switched fabric.

13. The multi-service platform system of claim 11 , wherein the switched fabric comprises a first switched fabric and a second switched fabric, wherein the fabric switch communicatively couples the first storage module to the first switched fabric, and wherein the fabric switch communicatively couples the second storage module to the second switched fabric.

14. The multi-service platform system of claim 9 , wherein communication between the backplane and the payload module occurs exclusively through the at least one multi-gigabit connector.

15. The multi-service platform system of claim 9 , wherein at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.

16. The multi-service platform system of claim 9 , wherein at least one of the first or second storage modules is coupled to communicate with at least one of the VMEbus network and the PCI network.

17. A payload module, comprising:

a storage module coupled to the payload module, wherein the storage module is coupled to communicate with a switched fabric, and wherein the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor;

at least one multi-gigabit connector coupled to a rear edge of the payload module and to the storage module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the storage module to a backplane, wherein the backplane includes a switched fabric coincident with at least one of a VMEbus network and a PCI network, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled to the storage module through the at least one multi-gigabit connector; and

a fabric-to-storage bridge module coupled to interface the storage module to the switched fabric, wherein the switched fabric operates coincident with a parallel bus on a backplane.

18. The payload module of claim 17 , wherein the storage module operates using one of SCSI, IDE/ATA, EIDE, Fibrechannel and ISCSI storage protocols.

19. The payload module of claim 17 , wherein the switched fabric comprises a first switched fabric and a second switched fabric, and wherein the storage module is coupled to store data communicated from at least one of the first switched fabric and the second switched fabric.

20. The payload module of claim 17 , wherein communication between the backplane and the payload module occurs exclusively through the at least one multi-gigabit connector.

21. The payload module of claim 17 , wherein at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.

22. The payload module of claim 17 , wherein the storage module is coupled to communicate with at least one of the VMEbus network and the PCI network.

23. A payload module, comprising:

a first storage module coupled to the payload module, wherein the first storage module is coupled to communicate with a switched fabric, and wherein the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor;

a second storage module coupled to the payload module, wherein the second storage module is coupled to communicate with the switched fabric;

at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to a backplane, wherein the backplane includes a switched fabric coincident with at least one of a VMEbus network and a PCI network, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled to the first and second storage module through the at least one multi-gigabit connector; and

a fabric-to-storage bridge module coupled to interface at least one of the first storage module and the second storage module to the switched fabric.

24. The payload module of claim 23 , further comprising a fabric switch coupled to the payload module, wherein the fabric switch is coupled to selectively communicate data between the switched fabric and one of the first storage module and the second storage module.

25. The payload module of claim 24 , wherein the switched fabric comprises a first switched fabric and a second switched fabric, and wherein the fabric switch communicatively couples one of the first storage module and the second storage module to one of the first switched fabric and the second switched fabric.

26. The payload module of claim 24 , wherein the switched fabric comprises a first switched fabric and a second switched fabric, wherein the fabric switch communicatively couples the first storage module to the first switched fabric, and wherein the fabric switch communicatively couples the second storage module to the second switched fabric.

27. The payload module of claim 23 , wherein communication between the backplane and the payload module occur exclusively through the at least one multi-gigabit connector.

28. The payload module of claim 23 , wherein at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.

29. The payload module of claim 23 , wherein one of the first or second storage modules is coupled to communicate with at least one of the VMEbus network and the PCI network.

Assignments (11)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
CHANGE OF NAME Recorded Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2008
From: MOTOROLA, INC.
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 020540/0714 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2004
From: SANDY, DOUGLAS L.; HARRIS, JEFFREY M.; TUFFORD, ROBERT C.
To: MOTOROLA, INC.
Reel/Frame 015830/0523 →