IP Library Granted Patent US 9,035,328
Granted Patent B2
US 9,035,328 · App. 13/021,496 · Granted May 19, 2015

Light-emitting diode component

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Quick Facts
Patent No.
US 9,035,328
App. No.
13/021,496
Granted
May 19, 2015
Kind
B2
Abstract

An LED component includes, according to a first embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an optical lens overlying the LED chips and having a lens base attached to the substrate, where the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base.

Claims (38)

1. A light emitting diode (LED) component comprising:

a monolithic substrate;

an array of LED chips disposed on a surface of the substrate; and

an optical lens overlying the LED chips and having a lens base attached to the substrate,

wherein the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base, at least one of the LED chips being mounted at a non-zero angle γ with respect to the surface of the substrate, the LED chip thereby comprising a tilt τ with respect to the perpendicular centerline.

2. The LED component of claim 1 wherein a center C A of the array is displaced from a center C L of the lens base by a displacement amount D.

3. The LED component of claim 2 wherein the displacement amount D lies between about 0.1 mm and 6.0 mm.

4. The LED component of claim 2 wherein a center C A of the array is displaced from a center C S of the surface of the substrate.

5. The LED component of claim 2 wherein a center C L of the lens base is displaced from a center C S of the surface of the substrate.

6. The LED component of claim 2 further comprising at least one additional array of LED chips disposed on the surface of the substrate, the additional array having a center C x displaced from the center C L of the lens base.

7. The LED component of claim 2 wherein the array of LED chips comprises a primary subsection and at least one additional subsection, the additional subsection being displaced from the primary subsection on the surface of the substrate,

wherein the center C A of the array is defined with respect to the primary subsection and the at least one additional subsection being positioned together.

8. The LED component of claim 1 wherein an amount of the non-zero angle γ lies between about 5° and about 35°, and an amount of the tilt t lies between about 55° and 85°.

9. The LED component of claim 1 wherein a plurality of the LED chips comprise the tilt τ.

10. The LED component of claim 9 , wherein the plurality includes from about 25% to about 75% of the LED chips in the array.

11. The LED component of claim 9 wherein an amount of the tilt τ is the same for each of the LED chips comprising the tilt τ.

12. The LED component of claim 9 wherein an amount of the tilt is different for at least one of the LED chips comprising the tilt τ.

13. The LED component of claim 1 wherein the optical lens comprises an asymmetric shape.

14. The LED component of claim 1 wherein the peak emission comprises a shift from the perpendicular centerline of between about 5 degrees and about 30 degrees.

15. The LED component of claim 14 wherein the peak emission comprises a shift from the perpendicular centerline of between about 10 degrees and about 20 degrees.

16. A light emitting diode (LED) component comprising:

a monolithic substrate; and

an array of individually unpackaged LED chips disposed on a surface of the substrate,

wherein at least one of the individually unpackaged LED chips is mounted at a non-zero angle γ with respect to the surface of the substrate, and

wherein a center C A of the array is displaced from a center C S of the surface of the substrate by a displacement amount D.

17. The LED component of claim 16 wherein the array is a disordered array.

18. A light emitting diode (LED) component comprising:

a monolithic substrate;

a first array and a second array of LED chips disposed on a surface of the substrate; and

an optical lens overlying the LED chips and having a lens base attached to the substrate,

wherein the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base,

wherein a center C A of the first array and a center C X of the second array are displaced from a center C L of the lens base.

19. A light emitting diode (LED) component comprising:

a monolithic substrate;

an array of LED chips disposed on a surface of the substrate; and

an optical lens overlying the LED chips and having a lens base attached to the substrate,

wherein the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base,

wherein a center C A of the array is displaced from a center C L of the lens base and from a center C S of the surface of the substrate.

Assignments (6)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 056031/0646 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA PREVIOUSLY RECORDED ON REEL 025195 FRAME 0246.ASSIGNOR(S) HEREBY CONFIRMS THE CONVEYING PARTY DATA INCLUDES FOUR INDIVIDUALS:THEODORE D. LOWES,ERIC J. TARSA.BERND P. KELLER AND DAVID T. EMERSON Recorded Jun 15, 2011
From: LOWES, THEODORE D.; TARSA, ERIC J.; KELLER, BERND P.; EMERSON, DAVID T.
To: CREE, INC.
Reel/Frame 026517/0004 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2011
From: LOWES, THEODORE D.; TARSA, ERIC J.
To: CREE, INC.
Reel/Frame 026115/0246 →