IP Library Granted Patent US 7,531,380
Granted Patent B2
US 7,531,380 · App. 10/818,619 · Granted May 12, 2009

Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof

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Quick Facts
Patent No.
US 7,531,380
App. No.
10/818,619
Granted
May 12, 2009
Kind
B2
Abstract

A light-emitting device comprises a substrate that has a contact plug extending therethrough between first and second opposing surfaces. An active region is on the first surface, a first electrical contact is on the active region, and a second electrical contact is adjacent to the second surface of the substrate. The contact plug couples the second electrical contact to the active region. Such a configuration may allow electrical contacts to be on opposing sides of a chip, which may increase the number of devices that may be formed on a wafer.

Claims (18)

1. A method of forming a light-emitting device, comprising:

forming an active region on a first substrate;

forming a via between first and second opposing surfaces in a second substrate;

forming a contact plug in the via; and

transferring the active region from the first substrate to the second substrate so as to be disposed on the first surface.

2. The method of claim 1 , wherein forming the active region comprises:

forming an n-type layer on the first substrate; and

forming a p-type layer on the n-type layer.

3. The method of claim 1 , further comprising:

forming an ohmic contact layer between the first surface and the active region.

4. The method of claim 3 , wherein forming the via comprises:

etching the second substrate using the ohmic contact layer as an etch stop.

5. The method of claim 4 , wherein etching the second substrate is performed using at least one of the following etching techniques: wet etching, dry etching, and micro-machining.

6. The method of claim 1 , wherein forming the contact plug comprises:

plating the via with gold, silver, a gold alloy, and/or a silver alloy.

7. The method of claim 1 , further comprising:

forming a first electrical contact on the active region; and

forming a second electrical contact that is coupled to the contact plug at the second surface.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2004
From: NEGLEY, GERALD H.
To: CREE, INC.
Reel/Frame 015184/0780 →