Switch module having one of 3U and 9U form factor
View Patent ↗A switch module includes a board ( 114 ) having one of a 3U form factor and a 9U form factor, and a central switching resource ( 116 ) coupled to the board, where the central switching resource is coupled to operate a switched fabric ( 106 ) on a backplane ( 104 ), where the switched fabric operates coincident with at least one of a VMEbus network and a PCI network on the backplane.
1. A multi-service platform system, comprising:
a backplane;
a switched fabric on the backplane;
at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;
a switch module having one of a 3U form factor and a 9U form factor, wherein the switch module is coupled to operate a central switching resource of the switched fabric; and
a payload module having one of a 3U form factor and a 9U form factor, wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network, wherein the payload module is communicatively coupled to the switch module over the switched fabric, wherein a rear edge of the payload module includes at least one multi-gigabit connector coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
2. The multi-service platform system of claim 1 , wherein the switch module is coupled to interface with the switched fabric and at least one of the VMEbus network and the PCI network.
3. The multi-service platform system of claim 1 , wherein the switch module is coupled to operate the switched fabric.
4. The multi-service platform system of claim 1 , wherein the switch module is coupled to the backplane through at least one switch module multi-gigabit connector.
5. The multi-service platform system of claim 1 , wherein the at least one switch module multi-gigabit connector passes at least one differential pair.
6. A computer chassis, comprising:
a backplane;
a switched fabric on the backplane;
at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;
a switch module having one of a 3U form factor and a 9U form factor, wherein the switch module is coupled to operate a central switching resource of the switched fabric; and
a payload module having one of a 3U form factor and a 9U form factor, wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network, wherein the payload module is communicatively coupled to the switch module over the switched fabric, wherein a rear edge of the payload module includes at least one multi-gigabit connector coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
7. The computer chassis of claim 6 , wherein the switch module is coupled to interface with the switched fabric and at least one of the VMEbus network and the PCI network.
8. The computer chassis of claim 6 , wherein the switch module is coupled to operate the switched fabric.
9. The computer chassis of claim 6 , wherein the switch module is coupled to the backplane through at least one switch module multi-gigabit connector.
10. The computer chassis of claim 9 , wherein the at least one switch module multi-gigabit connector passes at least one differential pair.
11. A method, comprising:
providing a backplane, wherein a switched fabric operates coincident with at least one of a VMEbus network and a PCI network on the backplane;
a switch module operating a central switching resource of the switched fabric, wherein the switch module has one of a 3U form factor and a 9U form factor; and
communicatively coupling a payload module to the backplane, wherein the payload module has one of a 3U form factor and a 9U form factor, wherein the payload module is communicatively coupled to the switched fabric and at least one of the VMEbus network and the PCI network, wherein the payload module is communicatively coupled to the switch module over the switched fabric, wherein a rear edge of the payload module includes at least one multi-gigabit connector coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
12. The method of claim 11 , further comprising coupling the switch module to interface with the switched fabric and at least one of the VMEbus network and the PCI network.
13. The method of claim 11 , further comprising coupling the switch module to operate the switched fabric.
14. The method of claim 11 , further comprising coupling the switch module to the backplane through at least one switch module multi-gigabit connector.
15. The method of claim 14 , wherein the at least one switch module multi-gigabit connector passes at least one differential pair.