IP Library Granted Patent US 8,772,798
Granted Patent B2
US 8,772,798 · App. 13/602,950 · Granted Jul 8, 2014

LED based lighting system

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Quick Facts
Patent No.
US 8,772,798
App. No.
13/602,950
Granted
Jul 8, 2014
Kind
B2
Abstract

An LED device comprises an LED chip or LED chip array for emitting light of a color spectrum, the LED chip or array being mounted on a component having a component surface. At least one color is applied to the component surface where the color is selected to reflect light to color tune the light emitted from the LED device to obtain a desired CRI.

Claims (35)

1. An LED device comprising:

an LED for emitting light, the light comprising at least one color constituent of a color spectrum, the LED mounted on a component having a component surface;

a non-white colorant of a first color applied to the component surface where the color is in the color spectrum of the at least one color constituent wherein the colorant is not disposed over the LED.

2. The LED device of claim 1 wherein a lens receives the light.

3. The LED device of claim 1 wherein the component surface reflects a portion of the light emitted from the LED chip.

4. The LED device of claim 1 wherein the colorant is in a solder mask applied to the component.

5. The LED device of claim 1 wherein the colorant is applied to the entire component surface.

6. The LED device of claim 1 wherein the colorant is applied to a portion of the exposed component surface.

7. The LED device of claim 1 wherein the color is applied to a first component surface and a second color is applied to a second component surface.

8. An LED device comprising:

a plurality of LED chips each of the LED chips emitting light of a color spectrum, the plurality of LED chips mounted on a component having a component surface;

a non-white colorant applied to the component surface where the colorant is in the color spectrum of at least one of the plurality of LED chips wherein the colorant is not disposed over the plurality of LED chips.

9. The LED device of claim 8 wherein the component surface reflects a portion of the light emitted from the plurality of LED chips.

10. The LED device of claim 8 wherein the colorant is in a solder mask applied to the component.

11. The LED device of claim 8 wherein the colorant is applied to the entire component surface.

12. The LED device of claim 8 wherein the colorant is applied to a first area of the component surface and a second color is applied to a second area of the component surface.

13. The LED device of claim 12 wherein the colorant is in the color spectrum of the light emitted from a first one of the plurality of LED chips and the second color is in the spectrum of the light emitted from a second one of the plurality of LED chips, wherein the color of the light emitted from the first one of the plurality of LED chips is different than the color of the light emitted from the second one of the plurality of LED chips.

14. An LED device comprising:

an LED chip for emitting light of a color spectrum, the LED chip mounted on a component having a component surface;

a non-white colorant applied to the component surface where the colorant is selected to reflect non-white light that is mixed with the light emitted from the LED chip to color tune the light emitted from the LED device to obtain a desired CRI wherein the colorant is not disposed over the LED chip.

15. The LED device of claim 14 wherein a lens receives the emitted light.

16. The LED device of claim 14 wherein the colorant is in a solder mask.

17. The LED device of claim 14 wherein the colorant is applied to the entire exposed component surface.

18. The LED device of claim 14 wherein the colorant is applied to a first area of the component surface and a second color is applied to a second area of the component surface.

19. The LED device of claim 14 wherein the colorant matches the light emitted from the LED device.

20. An LED device comprising:

an LED chip for emitting light of a color spectrum, the LED chip mounted on a component having a component surface;

a non-white colorant applied to the component surface where the colorant is in a second color spectrum that is different than the color spectrum wherein the colorant is not disposed over the LED chip.

21. The LED device of claim 20 wherein the component surface reflects a portion of the light emitted from the LED chip.

22. The LED device of claim 20 wherein the colorant is in a solder mask applied to the component.

23. The LED device of claim 20 wherein the light has a plurality of color components and the colorant is in the color spectrum of at least one of the color components.

24. The LED device of claim 20 wherein the color spectrum is white and the second color spectrum is the red spectrum.

25. An LED device comprising:

an LED chip for emitting light of a color spectrum, the LED chip mounted on a component having a component surface;

a non-white colorant applied to the exposed surface where the colorant is selected to reflect light to color tune the light emitted from the LED device to obtain a desired CRI wherein the colorant is not disposed over the LED chip wherein the colorant matches the light emitted from the LED device.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2012
From: SEIBEL, HARRY
To: CREE, INC.
Reel/Frame 028894/0426 →