IP Library Patent Application 18987626
Patent Application Utility
App. No. 18/987,626 · Confirmation No. 3337

COEFFICIENT OF THERMAL EXPANSION STRUCTURES IN SUBMOUNTS OF LIGHT-EMITTING DIODES

Applicant: CreeLED, Inc.
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2026-04-09 NTC.PUB Notice of Publication 1 View
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Quick Facts
App. No.
18/987,626
Filed
2024-12-19
Pub. No.
US20260101614A1
Art Unit
OPAP