IP Library › Patent Application 63704348
Patent Application Provisional
App. No. 63/704,348 · Confirmation No. 7009

COEFFICIENT OF THERMAL EXPANSION STRUCTURES IN SUBMOUNTS OF LIGHT-EMITTING DIODES

Applicant: CreeLED, Inc.
Provisional Application Expired
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 Code Description Pages PDF
2024-10-17 APP.FILE.REC Filing Receipt 3 View
2024-10-17 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2024-10-07 DRW.SUPP Drawings-black and white line and/or other drawings — View
2024-10-07 SPEC Specification — View
2024-10-07 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-10-07 ADS Application Data Sheet 8 View
2024-10-07 N417.PYMT Electronic Fee Payment 2 View
2024-10-07 PA.. Power of Attorney 2 View
2024-10-07 SPEC Specification 22 View
2024-10-07 CLM Claims 2 View
2024-10-07 ABST Abstract 1 View
2024-10-07 DRW.NONBW Drawings-other than black and white line drawings 11 View
2024-10-07 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
63/704,348
Filed
2024-10-07