STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES WITH MULTIPLE LIGHT-EMITTING DIODE CHIPS
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly structures for LED packages with multiple LED chips are disclosed. LED package structures include arrangements of one or more of body structures with multiple cavities for LED chips, encapsulants with lenses registered with the multiple cavities, and lead frame structures at least partially within the body structures. Cavities of body structures and/or corresponding lenses are disclosed with certain asymmetries configured to direct highest intensities of LED chip emissions in directions that are offset from cavity centers. Body structures are disclosed with one or more continuously planar surfaces that promote enhanced flexibility in encapsulant and/or lead frame structures and improved resistance to moisture ingress. One or more combinations of cavities and/or lenses asymmetries may be implemented in combination with one or more continuously planar body surfaces.
1 . A light-emitting diode (LED) package comprising:
a body forming a plurality of cavities in a top face of the body, the top face being continuously planar between opposing side faces of the body that bound the top face;
a lead frame structure comprising a separate pair of leads arranged within each cavity of the plurality of cavities and where each of the leads extends from one of the opposing side faces to be accessible outside the body;
at least one LED chip electrically coupled with the lead frame structure within each cavity of the plurality of cavities; and
an encapsulant forming a plurality of lenses on the top face of the body.
2 . The LED package of claim 1 , wherein the encapsulant comprises a flash portion that extends between adjacent lenses of the plurality of lenses.
3 . The LED package of claim 2 , wherein the flash portion extends on the top face to a position that is within 1 millimeter (mm) of at least one of the side faces of the body.
4 . The LED package of claim 2 , wherein a thickness of the flash portion relative to the top face is in a range from 0.1 mm to 0.5 mm.
5 . The LED package of claim 1 , wherein a lens shape for each lens of the plurality of lenses is configured to direct highest intensity emissions in directions offset from a center of each cavity.
6 . The LED package of claim 5 , wherein the lens shape has no more than one line of symmetry.
7 . The LED package of claim 1 , wherein each cavity of the plurality of cavities comprises a cavity floor and a sidewall that extends between the top face of the body and the cavity floor, and an angle of the sidewall relative to the cavity floor varies around a perimeter of the at least one LED chip.
8 . The LED package of claim 7 , wherein:
the angle of the sidewall is in a range from 5 degrees to 25 degrees on one side of the at least one LED chip and in a range from 25 degrees to 50 degrees on an opposing side of the at least one LED chip.
9 . The LED package of claim 1 , wherein one or more of the side faces of the body are continuously planar between the top face and a bottom face of the body.
10 . The LED package of claim 9 , wherein the one or more side faces are angled inward from the bottom face to the top face.
11 . A light-emitting diode (LED) package comprising:
a body with a top face, a bottom face, and one or more side faces that bound the top face and the bottom face, the body forming a plurality of cavities in the top face of the body, and the one or more side faces being continuously planar between the top face and the bottom face;
a plurality of LED chips, wherein each cavity of the plurality of cavities comprises at least one LED chip of the plurality of LED chips;
a plurality of leads electrically coupled to the plurality of LED chips, the plurality of leads extending outside the body from the one or more side faces; and
an encapsulant forming a plurality of lenses on the top face of the body.
12 . The LED package of claim 11 , wherein portions of the plurality of leads extending outside the body from the one or more side faces are coplanar with the bottom face of the body.
13 . The LED package of claim 11 , wherein the one or more side faces are angled inward from the bottom face to the top face.
14 . The LED package of claim 11 , wherein a separate lens of the plurality of lenses is registered with a separate cavity of the plurality of cavities.
15 . The LED package of claim 14 , wherein a lens shape for each separate lens of the plurality of lenses is configured to direct highest intensity emissions in directions offset from a center of each cavity.
16 . The LED package of claim 15 , wherein the lens shape has no more than one line of symmetry.
17 . The LED package of claim 14 , wherein the encapsulant comprises a flash portion that extends between adjacent lenses of the plurality of lenses.
18 . The LED package of claim 17 , wherein the top face is continuously planar between opposing side faces of the body that bound the top face, and the flash portion extends on the top face to a position that is within 1 mm of the opposing side faces of the body.
19 . The LED package of claim 11 , wherein each cavity of the plurality of cavities comprises a cavity floor and sidewall that extends between the top face of the body and the cavity floor, and an angle of the sidewall relative to each cavity floor varies around a perimeter of each cavity.
20 . The LED package of claim 11 , wherein:
the body forms a rectangular shape with a long side and a short side;
the plurality of cavities are arranged in a linear manner in a direction corresponding to the long side; and
each cavity of the plurality of cavities has a single line of symmetry that is oriented parallel to the long side.