IP Library › Granted Patent US 1,102,268
Granted Patent S1
US 1,102,268 · App. 29/946,950 · Granted Nov 18, 2025

Light-emitting diode package

Inventors: Sarah Trinkle (Broadway, NC); Thomas Celano (Cary, NC); Robert Wilcox (Rolesville, NC); Colin Blakely (Raleigh, NC)
Assignee: CreeLED, Inc.
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Quick Facts
Patent No.
US 1,102,268
App. No.
29/946,950
Granted
Nov 18, 2025
Kind
S1
Claims (1)

The ornamental design for a light-emitting diode package, as shown and described.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2024
From: TRINKLE, SARAH; CELANO, THOMAS; WILCOX, ROBERT; BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 067706/0554 →
References Cited (44)
US D650343S · Andrews · 2011 [cited by examiner]
US D660257S · Andrews · 2012 [cited by examiner]
US D675169S · Chou · 2013 [cited by examiner]
US 8696159B2 · Andrews et al. · 2014 [cited by applicant]
US D711841S · Britt · 2014 [cited by examiner]
US D712849S · Britt · 2014 [cited by examiner]
US 9041042B2 · Andrews et al. · 2015 [cited by applicant]
US D741821S · Song · 2015 [cited by applicant]
US D749051S · Clark · 2016 [cited by examiner]
US D762183S · Kim et al. · 2016 [cited by applicant]
US 9515055B2 · Britt · 2016 [cited by examiner]
US D783547S · Bergmann · 2017 [cited by examiner]
US 9754926B2 · Donofrio et al. · 2017 [cited by applicant]
US D826871S · Reiherzer · 2018 [cited by examiner]
US 10234119B2 · Wilcox · 2019 [cited by applicant]
US 10439112B2 · Clark · 2019 [cited by examiner]
US 10559733B2 · Song · 2020 [cited by examiner]
US D915308S · Maruyama · 2021 [cited by examiner]
US D926714S · Wilcox et al. · 2021 [cited by applicant]
US 11121298B2 · Murthy et al. · 2021 [cited by applicant]
US 11552229B2 · Damborsky · 2023 [cited by examiner]
US D996377S · Celano et al. · 2023 [cited by applicant]
US D1036711S · Celano · 2024 [cited by examiner]
US D1057674S · Bailey · 2025 [cited by examiner]
US 12355013B2 · Rile · 2025 [cited by examiner]
US 20110220920A1 · Collins · 2011 [cited by examiner]
US 20120267671A1 · Jung · 2012 [cited by examiner]
US 20120286304A1 · LeToquin · 2012 [cited by examiner]
US 20130105835A1 · Wu · 2013 [cited by examiner]
US 20130322068A1 · Clark · 2013 [cited by examiner]
US 20130322070A1 · Clark · 2013 [cited by examiner]
US 20150179903A1 · Pun · 2015 [cited by examiner]
US 20190019780A1 · Kim · 2019 [cited by examiner]
US 20190067255A1 · Lim · 2019 [cited by examiner]
US 20200395349A1 · Lin · 2020 [cited by examiner]
US 20210057395A1 · Hsieh · 2021 [cited by examiner]
US 20220005987A1 · Wilcox · 2022 [cited by examiner]
US 20230140302A1 · Miller · 2023 [cited by examiner]
US 20230260972A1 · Celano · 2023 [cited by examiner]
US 20250248181A1 · Park · 2025 [cited by examiner]
JP D1655194S · 2020 [cited by applicant]
TW D228759S · 2023 [cited by applicant]
TW D231521S · 2024 [cited by applicant]
Official Letter for Taiwanese Patent Application No. 113306510, mailed Mar. 28, 2025, 9 pages. [cited by applicant]