ARRANGEMENTS OF MULTIPLE-JUNCTION LIGHT-EMITTING DIODE CHIPS IN LIGHT-EMITTING DIODE PACKAGES AND RELATED DISPLAYS
Solid state light-emitting devices and more particularly arrangements of multiple-junction light-emitting diode (LED) chips in LED packages and corresponding LED displays are disclosed. Multiple-junction LED chips are arranged in LED packages with single-junction LED chips. Multiple-junction LED chips are configured to have forward voltages the same or similar to single-junction LED chips in the same LED package. Common anode or common cathode arrangements for multiple-junction and single-junction LED packages are disclosed. Multiple-junction LED chips configured to provide different emission wavelengths than single-junction LED chips while also having same or similar forward voltages are disclosed.
1 . A light-emitting diode (LED) package comprising:
a support element;
at least one single-junction LED chip on the support element, the at least one single-junction LED chip comprising a first forward voltage; and
at least one multiple-junction LED chip on the support element, the at least one multiple-junction LED chip comprising at least two light-emitting junctions, the at least two light-emitting junctions being electrically coupled in series, and the at least one multiple-junction LED chip comprising a second forward voltage that is within twenty five percent of the first forward voltage.
2 . The LED package of claim 1 , wherein the second forward voltage is within fifteen percent of the first forward voltage.
3 . The LED package of claim 1 , further comprising an electrically conductive element on the support element, the electrically conductive element forming a common anode connection or a common cathode connection for the at least one single-junction LED chip and the at least one multiple-junction LED chip.
4 . The LED package of claim 3 , wherein the support element is a submount with a plurality of patterned traces on a surface of the submount.
5 . The LED package of claim 3 , wherein the support element is a lead frame structure comprising a lead frame and housing, and the electrically conductive element is a single lead of the lead frame.
6 . The LED chip of claim 3 , wherein the at least one single-junction LED chip and the at least one multiple-junction LED chip are electrically coupled with the electrically conductive element by way of a wire bond.
7 . The LED package of claim 3 , wherein at least one of the at least one single-junction LED chip and the at least one multiple-junction LED chip is flip-chip mounted and electrically coupled with the electrically conductive element.
8 . The LED package of claim 1 , wherein the support element comprises a lead frame structure, and the at least one single-junction LED chip is electrically coupled to a different pair of leads of the lead frame structure than the at least one multiple-junction LED chip.
9 . The LED package of claim 1 , wherein:
the at least one single-junction LED chip is configured to emit light of a first peak wavelength; and
the at least one multiple-junction LED chip is configured to emit light of a second peak wavelength, and the second peak wavelength differs from the first peak wavelength by at least 20 nanometers (nm).
10 . The LED package of claim 9 , further comprising:
an additional multiple-junction LED chip configured to emit light of a third peak wavelength that differs from the first peak wavelength and the second peak wavelength by at least 20 nm; and
an additional single-junction LED chip configured to emit light of a fourth peak wavelength that differs from the first peak wavelength, the second peak wavelength, and the third peak wavelength by at least 20 nm;
wherein the additional multiple-junction LED chip comprises a third forward voltage that is within twenty five percent of the first forward voltage and the second forward voltage.
11 . A light-emitting diode (LED) package comprising:
a support element;
at least one single-junction LED chip on the support element;
at least one multiple-junction LED chip on the support element; and
an electrically conductive element on the support element, the electrically conductive element forming a common anode connection or a common cathode connection for the at least one single-junction LED chip and the at least one multiple-junction LED chip.
12 . The LED package of claim 11 , wherein the support element is a submount and the electrically conductive element is a patterned trace on a surface of the submount.
13 . The LED package of claim 11 , wherein the support element is a lead frame structure comprising a lead frame and housing, and the electrically conductive element is a single lead of the lead frame.
14 . The LED package of claim 11 , wherein the support element comprises a lead frame structure, and the at least one single-junction LED chip is electrically coupled to a different pair of leads of the lead frame structure than the at least one multiple-junction LED chip.
15 . The LED package of claim 11 , wherein at least one of the at least one single-junction LED chip and the at least one multiple-junction LED chip is electrically coupled with the electrically conductive element by way of a wire bond.
16 . The LED package of claim 11 , wherein at least one of the at least one single-junction LED chip and the at least one multiple-junction LED chip is flip-chip mounted and electrically coupled with the electrically conductive element.
17 . The LED package of claim 11 , wherein:
the at least one single-junction LED chip is configured to emit light of a first peak wavelength; and
the at least one multiple-junction LED chip is configured to emit light of a second peak wavelength, and the second peak wavelength differs from the first peak wavelength by at least 20 nanometers (nm).
18 . The LED package of claim 17 , further comprising:
an additional multiple-junction LED chip configured to emit light of a third peak wavelength that differs from the first peak wavelength and the second peak wavelength by at least 20 nm;
wherein the electrically conductive element forms the common anode connection or the common cathode connection for the single-junction LED chip, the multiple-junction LED chip, and the additional multiple-junction LED chip.
19 . The LED package of claim 18 , further comprising:
an additional single-junction LED chip configured to emit light of a fourth peak wavelength that differs from the first peak wavelength, the second peak wavelength, and the third peak wavelength by at least 20 nm;
wherein the electrically conductive element forms the common anode connection or the common cathode connection for the single-junction LED chip, the additional single-junction LED chip, the multiple-junction LED chip, and the additional multiple-junction LED chip.
20 . A light-emitting diode (LED) display comprising:
a display panel; and
at least one LED package comprising:
at least one single-junction LED chip; and
at least one multiple-junction LED chip, the at least one single-junction LED chip and the at least one multiple-junction LED chip forming a pixel of the display panel.
21 . The LED display of claim 20 , wherein at least one of the at least one single-junction LED chip and the at least one multiple-junction LED chip is electrically coupled to a common anode connection or a common cathode connection.
22 . The LED display of claim 20 , wherein:
the at least one single-junction LED chip comprises a first forward voltage; and
the at least one multiple-junction LED chip comprises a second forward voltage that is within twenty five percent of the first forward voltage.