IP Library › Granted Patent US 908,929
Granted Patent S1
US 908,929 · App. 29/628,363 · Granted Jan 26, 2021

LED package

Inventors: Charles Chak Hau Pang (Fanling, HK); Victor Yue Kwong Lau (Laguna, HK); Tiancai Su (Huizhou, CN)
Assignee: CREE, INC.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 908,929
App. No.
29/628,363
Granted
Jan 26, 2021
Kind
S1
Claims (1)

The ornamental design for a LED package, as shown and described.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2021
From: CREE HONG KONG LIMITED
To: CREELED, INC.
Reel/Frame 056990/0571 →