Patent Assignment
Reel/Frame 056990/0571
Assignment of Assignor's Interest
Recorded: 2021-07-27
Pages: 9
Assignor
CREE HONG KONG LIMITED
Executed: 2021-03-01
Assignee
CREELED, INC.
4400 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties
(11)
Led Package and the Process Making the Same
Led Package and the Process Making the Same
Multi-chip light emitting diode modules
Emitter Package with Angled or Vertical Led
Water Resistant Surface Mount Device Package
Light Source of Light Emitting Diode
Patent:
633,631 →
Application:
29/293,900 →
Light Source of Light Emitting Diode
Patent:
634,863 →
Application:
29/294,459 →
Led Package
Patent:
662,902 →
Application:
29/377,708 →
Led Package
Patent:
656,906 →
Application:
29/380,636 →
Led Package
Patent:
671,661 →
Application:
29/412,854 →
Led Package
Patent:
908,929 →
Application:
29/628,363 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Feb 19, 2021
From: COTCO LUMINANT DEVICE LIMITED
To: CREE HONG KONG LIMITED
Reel/Frame 055328/0998 →
Assignment of Assignor's Interest
Feb 23, 2021
From: SHIEH, YUH-REN; LEUNG, CHI-WING
To: CREE HONG KONG LIMITED
Reel/Frame 055372/0097 →
Assignment of Assignor's Interest
Feb 23, 2021
From: LEUNG, CHI-WING
To: CREE HONG KONG LIMITED
Reel/Frame 055375/0724 →
Assignment of Assignor's Interest
Jun 26, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071739/0717 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →