Patent Assignment
Reel/Frame 058455/0725
Assignment of Assignor's Interest
Recorded: 2021-12-22
Pages: 14
Assignors
SUICH, DAVID
Executed: 2021-12-09
HUSSELL, CHRISTOPHER P.
Executed: 2021-12-09
CHECK, MICHAEL
Executed: 2021-12-09
BLAKELY, COLIN
Executed: 2021-12-22
WUESTER, STEVEN
Executed: 2021-12-21
COLLINS, BRIAN T.
Executed: 2021-12-08
Assignee
CREELED, INC.
4400 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties
(4)
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,628 →
Publication:
US 2023/0170447
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,671 →
Publication:
US 2023/0170335
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,678 →
Publication:
US 2023/0170449
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,685 →
Publication:
US 2023/0170445
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →