IP Library › Granted Patent US 1,036,711
Granted Patent S1
US 1,036,711 · App. 29/877,887 · Granted Jul 23, 2024

Light-emitting diode package

Inventors: Thomas Celano (Cary, NC); Alexis Rile (Durham, NC); Derek Miller (Columbus, OH); David Suich (Durham, NC); Colin Blakely (Raleigh, NC); Sarah Trinkle (Broadway, NC); Robert Wilcox (Rolesville, NC)
Assignee: CreeLED, Inc.
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Quick Facts
Patent No.
US 1,036,711
App. No.
29/877,887
Granted
Jul 23, 2024
Kind
S1
Claims (1)

The ornamental design for a light-emitting diode package, as shown and described.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2023
From: CELANO, THOMAS; RILE, ALEXIS; MILLER, DEREK; SUICH, DAVID; BLAKELY, COLIN; TRINKLE, SARAH; WILCOX, ROBERT
To: CREELED, INC.
Reel/Frame 063950/0373 →
Continuity (1)
Division 29827155 · Feb 17, 2022