Apparatus, system and method for use in mounting electronic elements
View Patent ↗The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a first direction and a chipset portion extending from the first coupling portion at a first acute angle and through an area exposed by the recess; a second lead element partially encased by the casing comprising a second coupling portion extending interior to the casing in a second direction substantially parallel to the first direction and a head portion extending from the second coupling portion at a second acute angle and partially terminating interior to the area exposed by the recess; and the chipset portion comprises a first indentation and a second indentation both extending into the area exposed through the recess.
1. A surface mount device comprising:
a casing comprising a first surface and a second surface, the second surface comprising a recess;
a first lead element partially encased by the casing, the first lead element comprising a first coupling portion and a chipset portion, the coupling portion extending interior to the casing from the first surface of the casing generally in a first direction, the chipset portion extending from the first coupling portion at a first acute angle relative to the first direction through an area exposed by the recess, and the first lead element terminating interior to the casing;
a second lead element partially encased by the casing and electrically isolated from the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing from the first surface of the casing generally in a second direction substantially parallel to the first direction, the head portion extending from the second coupling portion toward the chipset portion at a second acute angle relative to the second direction and partially terminating interior to the area exposed by the recess; and
the chipset portion of the first lead element comprises a first indentation and a second indentation opposite said first indentation, with said first and second indentations parallel to one another such that the width of said chipset portion narrows between said first and second indentations and, said indentations extending into the area exposed through the recess and proximate the second lead element.
2. The device of claim 1 wherein the first and second indentations comprise encased portions such that casing material extends through at least a portion of the encased portions of the first and second indentations , and exposed portions that extend into the area exposed through the recess.
3. The device of claim 2 , further comprising a fill material disposed within the recess and extending through at least a portion of the exposed portions of the first and second indentations.
4. The device of claim 1 wherein the first acute angle is perpendicular to the second acute angle.
5. The device of claim 1 , wherein interior to the casing the first coupling portion further comprises a first stepped portion that extends toward the second lead element substantially parallel to the first acute angle and a first extended portion extends from the first stepped portion in the first direction.
6. The device of claim 5 , wherein interior to the casing the second coupling portion further comprises a third stepped portion that extends toward the first lead element substantially parallel to the second acute angle and a third extended portion extending from the third stepped portion in the second direction.
7. The device of claim 1 , wherein a first width of the first coupling portion of the first lead is greater than the shortest distance between the first and second indentations in the chipset portion.
8. A surface mount device comprising:
a casing comprising a first surface and a second surface, the second surface comprising a recess;
a first lead element partially encased by the casing, the first lead element comprising a first coupling portion and a chipset portion, the coupling portion extending interior to the casing from the first surface of the casing generally in a first direction, the chipset portion extending from the first coupling portion at a first acute angle relative to the first direction through an area exposed by the recess, and the first lead element terminating interior to the casing;
a second lead element partially encased by the casing and electrically isolated from the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing from the first surface of the casing generally in a second direction substantially parallel to the first direction the head portion extending from the second coupling portion toward the chipset portion at a second acute angle relative to the second direction and partially terminating interior to the area exposed by the recess; and
the chipset portion of the first lead element comprises a first indentation and a second indentation both extending into the area exposed through the recess and the second indentation is located opposite the first indentation and proximate the second lead element, wherein the first and second indentations are substantially trapezoidal shaped and parallel sides of the trapezoidal shape of the first and second indentations are substantially parallel to an axis bisecting the chipset portion extending relative to the first direction at the first acute angle.
9. A surface mount device comprising:
a casing comprising a first surface and a second surface, the second surface comprising a recess;
a first lead element partially encased by the casing, the first lead element comprising a first coupling portion and a chipset portion, the coupling portion extending interior to the casing from the first surface of the casing generally in a first direction, the chipset portion extending from the first coupling portion at a first acute angle relative to the first direction through an area exposed by the recess, and the first lead element terminating interior to the casing;
a second lead element partially encased by the casing and electrically isolated from the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing from the first surface of the casing generally in a second direction substantially parallel to the first direction, the head portion extending from the second coupling portion toward the chipset portion at a second acute angle relative to the second direction and partially terminating interior to the area exposed by the recess, wherein interior to the casing the first coupling portion further comprises a second stepped portion extending from the first extended portion in a direction toward the second lead element substantially parallel to the first acute angle and a second extended portion extending from the second stepped portion in the first direction; and
the chipset portion of the first lead element comprises a first indentation and a second indentation both extending into the area exposed through the recess and the second indentation is located opposite the first indentation and proximate the second lead element.
10. The device of claim 9 , wherein interior to the casing the second coupling portion further comprises a third stepped portion that extends toward the first lead element substantially parallel to the second acute angle, a third extended portion extending in the second direction from the third stepped portion, a fourth stepped portion extending from the third extended portion toward the second lead element substantially parallel to the first acute angle, and fourth extended portion extending in the second direction from the fourth stepped portion.