ANCHORED ENCAPSULATION IN LED DEVICES
Light-emitting diode (LED) devices and more particularly anchored encapsulation in LED packages and related structures is disclosed. Anchoring structures are described herein that improve adhesion with encapsulant materials. Exemplary LED packages include support structures with recesses and one or more anchoring structures integrated along recess sidewalls, thereby increasing surface areas of the recess sidewalls. When encapsulant materials are provided within the recesses, portions of encapsulant materials may conform to the anchoring structures to promote increased contact area between the encapsulant materials and the support structures. Exemplary support structures include lead frame structures with housings that form the recesses or submount structures.
1 . A light-emitting diode (LED) package comprising:
a support structure forming a recess with at least one recess sidewall;
one or more LED chips within the recess;
an encapsulant within the recess and over the one or more LED chips; and
at least one anchoring structure integral with the at least one recess sidewall such that a portion of the encapsulant extends into the support structure at the at least one anchoring structure.
2 . The LED package of claim 1 , wherein the at least one anchoring structure is continuously arranged to form a ring along the at least one recess sidewall.
3 . The LED package of claim 1 , wherein the at least one anchoring structure is arranged in one or more segments along one or more portions of the at least one recess sidewall.
4 . The LED package of claim 3 , wherein the one or more segments of the at least one anchoring structure do not extend to corners of the recess.
5 . The LED package of claim 1 , wherein the at least one anchoring structure forms an indentation in the at least one recess sidewall and the indentation forms a rounded bottom.
6 . The LED package of claim 1 , wherein the at least one anchoring structure forms a well that extends into the at least one recess sidewall.
7 . The LED package of claim 1 , wherein the at least one anchoring structure forms an array of indentations along the at least one recess sidewall.
8 . The LED package of claim 1 , wherein the at least one anchoring structure comprises a textured surface of the at least one recess sidewall.
9 . The LED package of claim 1 , wherein the support structure comprises a lead frame structure with a housing, and the recess is formed within the housing.
10 . A lead frame structure comprising:
a lead frame;
a housing molded to the lead frame, the housing forming a recess with at least one recess sidewall, a portion of the lead frame being accessible at a floor of the recess; and
at least one anchoring structure integral with the housing, the at least one anchoring structure extending into the housing from the at least one recess sidewall.
11 . The lead frame structure of claim 10 , wherein the at least one anchoring structure is continuously arranged to form a ring along the at least one recess sidewall.
12 . The lead frame structure of claim 10 , wherein the at least one anchoring structure is arranged in one or more segments along one or more portions of the at least one recess sidewall.
13 . The lead frame structure of claim 10 , wherein the at least one anchoring structure forms an indentation in the at least one recess sidewall and the indentation forms a rounded bottom.
14 . The lead frame structure of claim 10 , wherein the at least one anchoring structure forms a well that extends into the at least one recess sidewall.
15 . The lead frame structure of claim 10 , wherein the at least one anchoring structure forms an array of indentations along the at least one recess sidewall.
16 . The lead frame structure of claim 10 , wherein the at least one anchoring structure comprises a textured surface of the at least one recess sidewall.
17 . A light-emitting diode (LED) display comprising:
a display panel; and
at least one LED package comprising:
a support structure forming a recess with at least one recess sidewall;
one or more LED chips within the recess;
an encapsulant within the recess and over the one or more LED chips; and
at least one anchoring structure integral with the at least one recess sidewall such that a portion of the encapsulant extends into the support structure at the at least one anchoring structure.
18 . The LED display of claim 17 , wherein the at least one anchoring structure forms one or more indentations in the at least one recess sidewall.
19 . The LED display of claim 17 , wherein the at least one anchoring structure forms a well that extends into the at least one recess sidewall.
20 . The LED display of claim 17 , wherein the at least one anchoring structure comprises a textured surface of the at least one recess sidewall.