MULTI-PLANARITY OF LIGHT EMITTING SURFACES IN LED COMPONENTS
Light-emitting diode (LED) packages and more particularly LED packages that have LED chips mounted at different angles with respect to each to modify a far-field emission pattern are disclosed. The LED chips in the LED package can either be pitched inwards so that the light emissions from the LED chips generally overlap, or the LED chips can be pitched outwards. The LED chips can be mounted on a floor of a housing that has a plurality of angled surfaces. In other embodiments, the LED chips can be mounted on a platform in the housing that has different angled surfaces. In other embodiments, the LED chips can be mounted on one or more lead frame pins that can be angled, or angled with respect to other lead frame pins. The LED package may also include a light collector or a lens in order to further modify the far-field emission pattern.
1 . A light-emitting diode (LED) package, comprising:
a housing that forms a recess; and
a plurality of LED chips arranged within the recess, wherein each LED chip of the plurality of LED chips is pitched at a different angle relative to other LED chips of the plurality of LED chips.
2 . The LED package of claim 1 , wherein LED chips of the plurality of LED chips are pitched away from each other such that normal angles of top surfaces of the plurality of LED chips diverge.
3 . The LED package of claim 2 , wherein the plurality of LED chips are mounted on a submount platform.
4 . The LED package of claim 3 , wherein the submount platform is mounted on lead frame pins of the housing.
5 . The LED package of claim 3 , wherein the submount platform is mounted between lead frame pins of the housing.
6 . The LED package of claim 3 , wherein the submount platform is integral to the housing between lead frame pins of the housing.
7 . The LED package of claim 3 , wherein the submount platform comprises a plurality of surfaces that are angled with respect to one another, and the LED chips of the plurality of LED chips are mounted on respective surfaces of the plurality of surfaces.
8 . The LED package of claim 2 , wherein the LED chips of the plurality of LED chips are mounted on a lead frame pin that comprises a plurality of surfaces that are angled with respect to one another.
9 . The LED package of claim 2 , wherein the LED chips of the plurality of LED chips are mounted on respective lead frame pins that are angled with respect to one another.
10 . The LED package of claim 1 , wherein the LED chips of the plurality of LED chips are pitched towards each other and wherein normal angles of top surfaces of the plurality of LED chips converge.
11 . The LED package of claim 10 , wherein the LED chips of the plurality of LED chips are mounted on a lead frame pin that comprises a plurality of surfaces that are angled with respect to one another.
12 . The LED package of claim 11 , wherein the LED chips of the plurality of LED chips are mounted on respective lead frame pins that are angled with respect to one another.
13 . The LED package of claim 10 , wherein the plurality of LED chips are mounted on a submount platform.
14 . The LED package of claim 13 , wherein the submount platform is mounted on lead frame pins of the housing.
15 . The LED package of claim 13 , wherein the submount platform is mounted between lead frame pins of the housing.
16 . The LED package of claim 13 , wherein the submount platform is integral to the housing between lead frame pins of the housing.
17 . The LED package of claim 1 , further comprising:
a molded lens over the plurality of LED chips and the housing.
18 . The LED package of claim 1 , further comprising:
a light collector arranged at least partially over the plurality of LED chips, wherein the light collector comprises a columnar protrusion at a top of the light collector and wherein the light collector is formed from a first light-transmissive material.
19 . The LED package of claim 18 , further comprising:
a reflective coating covering an entire outer surface of the light collector except for a reduced aperture at a top of the columnar protrusion.
20 . A light-emitting diode (LED) package comprising:
a housing that forms a recess with a recess floor and one or more recess sidewalls;
a lead frame structure extending through the housing, wherein a portion of the lead frame structure is arranged along the recess floor; and
a plurality of LED chips arranged within the recess and electrically coupled with the lead frame structure, wherein each LED chip of the plurality of LED chips is pitched at a different angle relative to other LED chips of the plurality of LED chips.
21 . The LED package of claim 20 , wherein LED chips of the plurality of LED chips are pitched away from each other such that normal angles of top surfaces of the plurality of LED chips diverge.
22 . The LED package of claim 20 , wherein the LED chips of the plurality of LED chips are pitched towards each other and wherein normal angles of top surfaces of the plurality of LED chips converge.
23 . A light-emitting diode (LED) package comprising:
a housing that forms a recess;
a plurality of LED chips arranged within the recess, wherein each LED chip of the plurality of LED chips is pitched at a different angle relative to other LED chips of the plurality of LED chips; and
a light collector arranged at least partially over the plurality of LED chips, wherein the light collector comprises an aperture at a top of a columnar protrusion of the light collector and wherein the light collector is formed from a first light-transmissive material, and wherein light from the plurality of LED chips is emitted via the aperture.
24 . The LED package of claim 23 , wherein LED chips of the plurality of LED chips are pitched away from each other such that normal angles of top surfaces of the plurality of LED chips diverge.
25 . The LED package of claim 23 , wherein the LED chips of the plurality of LED chips are pitched towards each other and wherein normal angles of top surfaces of the plurality of LED chips converge.
26 . The LED package of claim 23 , further comprising:
a reflective coating on a top surface of the light collector;
a fill material over the reflective coating, wherein the fill material is a light-altering material; and
a lens over the fill material, the aperture of the light collector, and at least a portion of the housing.
27 . A light-emitting diode (LED) display comprising:
a display panel; and
at least one LED package comprising:
a housing that forms a recess; and
a plurality of LED chips arranged within the recess, wherein each LED chip of the plurality of LED chips is pitched at a different angle relative to other LED chips of the plurality of LED chips.
28 . The LED display of claim 27 , wherein LED chips of the plurality of LED chips are pitched away from each other such that normal angles of top surfaces of the plurality of LED chips do diverge.
29 . The LED display of claim 27 , wherein the LED chips of the plurality of LED chips are pitched towards each other and wherein normal angles of top surfaces of the plurality of LED chips converge.
30 . The LED display of claim 27 , wherein the at least one LED package further comprises:
a light collector arranged at least partially over the plurality of LED chips, wherein the light collector comprises a columnar protrusion at a top of the light collector and wherein the light collector is formed from a first light-transmissive material.