Arrangements for light emitting diode packages
Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED packages are disclosed. Arrangements for LED packages are disclosed that provide improved reliability and improved emission characteristics in a variety of applications, including outdoor LED displays as well as general illumination. LED packages are disclosed with linear arrangements of LED chips and corresponding lenses to provide improved visibility and color mixing at higher viewing angles. LED packages are disclosed that include different types of lenses that are arranged within the same LED package depending on desired emission characteristics. Body structures for LED packages are disclosed that include arrangements for improved adhesion with encapsulant materials and optional potting materials to provide improved moisture barriers.
1. A lighting emitting diode (LED) package comprising:
a body comprising:
a primary emission face;
a mounting face; and
a body mesa formed at the primary emission face, the body mesa forming at least two sidewalls that are coupled to one another by a rounded corner of the body mesa, wherein the body mesa forms a plurality of cavities at the primary emission face;
a plurality of LED chips, wherein each cavity of the plurality of cavities comprises at least one LED chip of the plurality of LED chips; and
an encapsulant over the plurality of LED chips and coupled to the at least two sidewalls and the rounded corner of the body mesa;
wherein the encapsulant comprises a pigment that is registered with a first cavity of the plurality of cavities, the pigment corresponding to an emission color of the at least one LED chip that is within the first cavity.
2. The LED package of claim 1 , wherein the encapsulant forms a plurality of lenses and a separate lens of the plurality of lenses is registered with each cavity of the plurality of cavities.
3. The LED package of claim 2 , wherein each lens comprises a round lens base.
4. The LED package of claim 2 , wherein each lens comprises an oval lens base.
5. The LED package of claim 2 , wherein at least one lens comprises a round lens base and at least one other lens comprises an oval lens base.
6. The LED package of claim 1 , wherein the encapsulant forms a lens that is registered with the first cavity of the plurality of cavities and the encapsulant further forms a flat surface that is registered with a second cavity of the plurality of cavities.
7. The LED package of claim 6 , wherein a sensor device is arranged within the second cavity.
8. The LED package of claim 1 , wherein the plurality of cavities are arranged with a linear alignment.
9. The LED package of claim 1 , wherein one or more surface features are formed in the body mesa between adjacent cavities of the plurality of cavities.
10. The LED package of claim 1 , wherein one or more surface features are formed along at least one of the at least two sidewalls of the body mesa.
11. The LED package of claim 1 , wherein the pigment is a first pigment region registered with the first cavity and the encapsulant further comprises separate second and third pigment regions that are respectively registered with corresponding second and third cavities of the plurality of cavities, wherein the second pigment region corresponds to an emission color of the at least one LED chip that is within the second cavity and the third pigment region corresponds to an emission color of the at least one LED chip that is within the third cavity.
12. An LED package comprising:
a body comprising a primary emission face and a mounting face, the primary emission face forming a plurality of cavities that are arranged in a linear alignment;
a plurality of LED chips, wherein each cavity of the plurality of cavities comprises at least one LED chip of the plurality of LED chips; and
an encapsulant over the plurality of LED chips, the encapsulant forming a plurality of lenses and a separate lens of the plurality of lenses is registered with each cavity of the plurality of cavities;
wherein the encapsulant comprises a pigment that is registered with a first cavity of the plurality of cavities, the pigment corresponding to an emission color of the at least one LED chip that is within the first cavity.
13. The LED package of claim 12 , wherein an aspect ratio of a length and width of the body is at least 2:1.
14. The LED package of claim 13 , wherein the aspect ratio is in a range from about 2:1 to about 4:1.
15. The LED package of claim 12 , wherein each lens comprises a round lens base.
16. The LED package of claim 12 , wherein each lens comprises an oval lens base.
17. The LED package of claim 12 , wherein at least one lens comprises a round lens base and at least one other lens comprises an oval lens base.
18. An LED package comprising:
a body comprising a primary emission face and a mounting face, the primary emission face forming a plurality of cavities;
a plurality of LED chips, wherein each cavity of the plurality of cavities comprises at least one LED chip of the plurality of LED chips; and
an encapsulant over the plurality of LED chips, the encapsulant forming a first lens that is registered with a first cavity of the plurality of cavities and a second lens that is registered with a second cavity of the plurality of cavities, wherein the first lens forms a shape that is different than the second lens;
wherein the encapsulant comprises a pigment that is registered with the first cavity that corresponds to an emission color of the at least one LED chip that is within the first cavity.
19. The LED package of claim 18 , wherein the first lens comprises a round lens base and the second lens comprises an oval lens base.
20. The LED package of claim 18 , wherein the encapsulant forms a flat surface that is registered with a third cavity of the plurality of cavities.
21. The LED package of claim 20 , wherein a sensor device is arranged within the third cavity.
22. The LED package of claim 18 , wherein the plurality of cavities are arranged with a linear alignment.