Patent Application
Utility
App. No. 18/934,434
· Confirmation No. 5545
ARRANGEMENTS FOR LIGHT EMITTING DIODE PACKAGES
Applicant:
CreeLED, Inc.
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| 2026-07-17 | REF.OTHER |
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| 2026-07-17 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 5 | View | |
| 2026-07-17 | REF.OTHER |
Other reference-Patent/Application/Search Documents | 9 | View | |
| 2026-07-17 | N417 |
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| 2026-05-07 | NTC.PUB |
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| 2025-01-08 | REF.OTHER |
Other reference-Patent/Application/Search Documents | 8 | View | |
| 2025-01-08 | FOR |
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| 2025-01-08 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 5 | View | |
| 2025-01-08 | FOR |
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| 2025-01-08 | FOR |
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| 2025-01-08 | N417 |
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| 2024-11-20 | APP.FILE.REC |
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| 2024-11-18 | CFILE |
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| 2024-11-18 | N417 |
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| 2024-11-14 | APP.FILE.REC |
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| 2024-11-01 | R3.73 |
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| 2024-11-01 | N417 |
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| 2024-11-01 | APP.TEXT |
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| 2024-11-01 | DRW.SUPP |
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| 2024-11-01 | SPEC |
Specification | 26 | View | |
| 2024-11-01 | CLM |
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| 2024-11-01 | N417.PYMT |
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| 2024-11-01 | OATH |
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Inventors
Chak Hau Pang
Fanling, HONG KONG
JuZuo Sheng
Huizhou, CHINA
Yue Kwong Lau
Kowloon, HONG KONG
Zhenyu Zhong
Tseung Kwan O, HONG KONG
Attorneys & Agents of Record
Classification
USPC
257/89
H10W90/00
H10H20/852
H10H20/8514
H10H20/855
H10H20/853
H10H20/8506
Prosecution
- Examiner
- CENTRAL, DOCKET
- Art Unit
- OPAP
- Customer No.
- 27820
- Docket No.
- 3394-053-US2
- Confirmation No.
- 5545
Publication
- Pub. No.
- US20260130020A1
- Pub. Date
- 2026-05-07
from
CREELED, INC.,
PENGUIN COMPUTING, INC.,
PENGUIN SOLUTIONS CORPORATION (DE),
SMART EMBEDDED COMPUTING, INC.,
SMART HIGH RELIABILITY SOLUTIONS LLC,
SMART MODULAR TECHNOLOGIES, INC.
PATENT SECURITY AGREEMENT
Recorded 2025-06-30
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Quick Facts
- App. No.
- 18/934,434
- Filed
- 2024-11-01
- Pub. No.
- US20260130020A1
- Examiner
- CENTRAL, DOCKET
- Art Unit
- OPAP
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