IP Library › Granted Patent US 1,087,430
Granted Patent S1
US 1,087,430 · App. 29/876,413 · Granted Aug 5, 2025

Light-emitting diode package

Inventors: JuZuo Sheng (Huizhou, CN); Xiang Fei (Huizhou, CN); Robert David Schmidt (Wake Forest, NC)
Assignee: CreeLED, Inc.
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Quick Facts
Patent No.
US 1,087,430
App. No.
29/876,413
Granted
Aug 5, 2025
Kind
S1
Claims (1)

The ornamental design for a light-emitting diode package, as shown and described.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2023
From: SHENG, JUZUO; FEI, XIANG; SCHMIDT, ROBERT DAVID
To: CREELED, INC.
Reel/Frame 063716/0464 →