Miniature surface mount device with large pin pads

1. A light emitting diode (LED) package comprising:

a lead frame comprising a plurality of electrically conductive chip carriers;

an LED disposed on each one of the plurality of electrically conductive chip carriers, each LED having a first electrical terminal and a second electrical terminal, wherein the first electrical terminal of each LED is electrically coupled to the corresponding electrically conductive chip carrier;

a plastic casing at least partially encasing the lead frame; and

a plurality of electrically conductive connection parts separate from the plurality of electrically conductive chip carriers, each electrically conductive chip carrier having an upper surface, a lower surface, and a chip carrying pad on the upper surface, each electrically conductive connection part having an upper surface, a lower surface, and a connection pad on the upper surface, wherein the electrically conductive chip carriers and the electrically conductive connection parts comprise sheet metal,

wherein the second electrical terminal of each LED is electrically coupled to a connection pad of a corresponding one of a plurality of electrically conductive connection parts,

wherein a profile height of the LED package is less than 1.0 mm, and

wherein a surface area of the upper surface of each electrically conductive connection part is less than about one half of a surface area of the upper surface of each electrically conductive chip carrier.

2. The LED package of claim 1 , wherein the LED package has a width of less than about 2.6 mm, and wherein the LED package has a length of less than about 2.6 mm.

3. The LED package of claim 1 , wherein the first and second electrical terminals of each of the plurality of LEDs comprise a cathode and an anode, respectively.

4. The LED package of claim 3 , wherein the second electrical terminal of each of the plurality of LEDs is electrically coupled to the connection pad of the corresponding electrically conductive connection part by a single wire bond.

5. The LED package of claim 4 , wherein the lower surface of each of the electrically conductive connection parts and the electrically conductive chip carriers have a pad area of about 0.4 mm by about 0.7 mm.

6. The LED package of claim 4 , wherein the chip carrying pad has a same profile width as the corresponding conductive connection pad.

7. The LED package of claim 1 , wherein the plastic casing comprises a square-like or rectangular cavity having a depth about 0.5 mm.

8. The LED package of claim 1 , wherein each of the electrically conductive chip carriers supports a single LED that individually emits red, green, or blue light.

9. The LED package of claim 1 , wherein the plastic casing comprises a thermoplastic.

10. The LED package of claim 9 , wherein the plastic casing comprises one of a white polyphthalamide or a black polyphthalamide.

11. The LED package of claim 1 , wherein the lead frame comprises a plurality of leads bent to extend outside of and along a bottom surface of the plastic casing, the leads comprising the electrically conductive chip carriers on an opposite side of the bottom surface.

12. The LED package of claim 1 , wherein the LEDs extend along an axis, wherein a gap extending parallel with the axis separates the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers such that all of the plurality of electrically conductive connection parts is on one side of the gap and all of the plurality of electrically conductive chip carriers is on the other side of the gap.

13. The LED package of claim 12 , wherein adjacent electrically conductive chip carriers have asymmetrical upper surface contours with respect to a middle line of a carrier gap separating the adjacent electrically conductive chip carriers, the carrier gap extending perpendicular to the gap separating the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers.

14. A device comprising:

a casing comprising opposed, first and second main surfaces, opposed side surfaces, and opposed end surfaces, the casing defining a cavity extending into the interior of the casing from the first main surface; and

a lead frame at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive chip carriers;

a single LED on a chip carrying pad of each electrically conductive chip carrier, each LED having a first electrical terminal and a second electrical terminal, wherein the first electrical terminal of each LED is electrically coupled to the corresponding electrically conductive chip carrier; and

a plurality of electrically conductive connection parts separate from the plurality of electrically conductive chip carriers, each electrically conductive chip carrier having an upper surface, a lower surface, and a chip carrying pad on the upper surface, each electrically conductive connection part having an upper surface, a lower surface, and a connection pad on the upper surface, wherein the electrically conductive chip carriers and the electrically conductive connection parts comprise sheet metal,

wherein the second electrical terminal of each LED is electrically coupled to a connection pad of a corresponding one of a plurality of electrically conductive connection parts,

wherein a depth of the cavity is less than 0.6 mm and a profile height of the surface mount device is less than 1.00 mm, and

wherein a surface area of the upper surface of each electrically conductive connection part is less than about one half of a surface area of the upper surface of each electrically conductive chip carrier.

15. The device of claim 14 , wherein the first and second electrical terminals of each LED comprise a cathode and an anode, respectively.

16. The device of claim 14 , wherein the first and second electrical terminals of each LED comprise a cathode and an anode, respectively, and wherein each LED emits red, green, or blue light.

17. The device of claim 16 , wherein the second electrical terminal of each LED is electrically coupled to the connection pad of the corresponding electrically conductive connection part by a single wire bond.

18. The device of claim 14 , wherein the lower surface of each of the electrically conductive connection parts and the electrically conductive chip carriers have a pad area larger than about 0.4 mm by about 0.7 mm.

19. The device of claim 14 , wherein the cavity has an opening angle about 30° in a vertical direction.

20. The device of claim 14 , wherein the LEDs extend in a first direction along a center axis of the surface mount device.

21. The device of claim 14 , wherein the electrically conductive chip carrier proximate to a center line of the surface mount device has a width of about 0.47 mm to 0.53 mm.

22. The device of claim 14 , wherein the LEDs extend along an axis, wherein a gap extending parallel with the axis separates the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers such that all of the plurality of electrically conductive connection parts is on one side of the gap and all of the plurality of electrically conductive chip carriers is on the other side of the gap.

23. The device of claim 22 , wherein adjacent electrically conductive chip carriers have asymmetrical upper surface contours with respect to a middle line of a carrier gap separating the adjacent electrically conductive chip carriers, the carrier gap extending perpendicular to the gap separating the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers.

24. An LED display comprising:

a substrate carrying an array of surface mount devices (SMDs) arranged in vertical columns and horizontal rows, each of the SMDs comprising a casing and containing a plurality of LEDs configured to be energized to produce in combination a substantially full range of colors and to define one pixel of the display; and

signal processing and LED drive circuitry electrically connected to selectively energize the array of SMDs for displaying images on the LED display,

wherein each SMD further comprises a lead frame at least partially encased in a respective casing, each lead frame comprising:

a plurality of electrically conductive chip carriers; and

a plurality of electrically conductive connection parts separate, from the plurality of electrically conductive chip carriers, each electrically conductive chip carrier having an upper surface, a lower surface, and a chip carrying pad on the upper surface, each electrically conductive connection part having an upper surface, a lower surface, and a connection pad on the upper surface, wherein the electrically conductive chip carriers and the electrically conductive connection parts comprise sheet metal,

wherein each LED has a first electrical terminal and a second electrical terminal, wherein the first electrical terminal of each LED is electrically coupled to the corresponding electrically conductive chip carrier,

wherein the second electrical terminal of each LED is electrically coupled to a connection pad of a corresponding one of a plurality of electrically conductive connection parts,

wherein a surface area of the upper surface of each electrically conductive connection part is less than about one half of a surface area of the upper surface of each electrically conductive chip carrier,

wherein each pixel of the display has a size about 2.8 mm or less by about 2.8 mm or less; and

wherein a profile height of the SMD is less than 1.0 mm.

25. The LED display of claim 24 , wherein for each of the SMDs, the LEDs extend along an axis, wherein a gap extending parallel with the axis separates the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers such that all of the plurality of electrically conductive connection parts is on one side of the gap and all of the plurality of electrically conductive chip carriers is on the other side of the gap.

26. The LED display of claim 25 , wherein for each of the SMDs, adjacent electrically conductive chip carriers have asymmetrical upper surface contours with respect to a middle line of a carrier gap separating the adjacent electrically conductive chip carriers, the carrier gap extending perpendicular to the gap separating the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers.

27. A light emitting diode (LED) package comprising:

a lead frame comprising a plurality of electrically conductive chip carriers;

an LED disposed on each one of the plurality of electrically conductive chip carriers, each LED having a first electrical terminal and a second electrical terminal, wherein the first electrical terminal of each LED is electrically coupled to the corresponding electrically conductive chip carrier;

a polymer casing at least partially encasing the lead frame, the polymer casing comprising opposed, first and second main surfaces having a height distance therebetween, opposed side surfaces having a width distance therebetween, and opposed end surfaces having a length distance therebetween, wherein the height distance is less than 1.0 mm, and wherein the width distance and the length distance are less than about 2.6 mm; and

a plurality of electrically conductive connection parts separate from the plurality of electrically conductive chip carriers, each electrically conductive chip carrier having an upper surface, a lower surface, and a chip carrying pad on the upper surface, each electrically conductive connection part having an upper surface, a lower surface, and a connection pad on the upper surface, wherein the electrically conductive chip carriers and the electrically conductive connection parts comprise sheet metal,

wherein the second electrical terminal of each LED is electrically coupled to a connection pad of a corresponding one of a plurality of electrically conductive connection parts, and

wherein a surface area of the upper surface of each electrically conductive connection part is less than about one half of a surface area of the upper surface of each electrically conductive chip carrier.

28. The LED package of claim 27 wherein the casing at least partially encases the lead frame and defines a cavity extending into the interior of the casing from the first main surface to a floor of the cavity and the ratio of the area of the cavity floor over the area of the main surface is at least 35%.

29. The LED package of claim 27 comprising a red LED die, a green LED die and a blue LED die.

30. The LED package of claim 27 wherein the casing at least partially encases the lead frame and defines a cavity extending into the interior of the casing from the first main surface to a floor of the cavity, and each electrically conductive chip carrier has a length extending at least over ½ of a cavity floor length.

31. The LED package of claim 27 , wherein the LEDs extend along an axis, wherein a gap extending parallel with the axis separates the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers such that all of the plurality of electrically conductive connection parts is on one side of the gap and all of the plurality of electrically conductive chip carriers is on the other side of the gap.

32. The LED package of claim 31 , wherein adjacent electrically conductive chip carriers have asymmetrical upper surface contours with respect to a middle line of a carrier gap separating the adjacent electrically conductive chip carriers, the carrier gap extending perpendicular to the gap separating the plurality of electrically conductive connection parts from the plurality of electrically conductive chip carriers.