Patent Application
Utility
App. No. 18/812,005
· Confirmation No. 8146
LENS STRUCTURES FOR LIGHT-EMITTING DIODE (LED) CHIPS IN LED PACKAGES
Applicant:
CreeLED, Inc.
Docketed New Case - Ready for Examination
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2026-04-02 | NTC.PUB |
Notice of Publication | 1 | View | |
| 2024-10-23 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2024-10-23 | TRAN.LET |
Transmittal Letter | 2 | View | |
| 2024-10-23 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 5 | View | |
| 2024-09-10 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2024-09-10 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2024-09-10 | WELCOME.LET |
Welcome Letter from USPTO Director and Deputy Director | 1 | View | |
| 2024-08-22 | APP.TEXT |
Application body structured text document | — | View | |
| 2024-08-22 | PA.. |
Power of Attorney | 2 | View | |
| 2024-08-22 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2024-08-22 | OATH |
Oath or Declaration filed | 10 | View | |
| 2024-08-22 | ADS |
Application Data Sheet | 9 | View | |
| 2024-08-22 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2024-08-22 | SPEC |
Specification | 27 | View | |
| 2024-08-22 | CLM |
Claims | 4 | View | |
| 2024-08-22 | ABST |
Abstract | 1 | View | |
| 2024-08-22 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2024-08-22 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View | |
| 2024-08-22 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View |
Inventors
David Suich
Durham, NC
F James Claire
Chapel Hill, NC
Joseph G. Sokol
Durham, NC
Robert Wilcox
Rolesville, NC
Colin Blakely
Raleigh, NC
Attorneys & Agents of Record
Classification
USPC
257/91
H10H20/855
H10H20/85
H10H29/8514
H10H20/8514
H10H20/8502
H10H29/85
H10H29/8508
H10H29/8506
H10H29/855
H10H29/24
H10H20/857
H10H20/8508
H10H20/8506
H10H20/856
H10W90/00
Publication
- Pub. No.
- US20260059907A1
- Pub. Date
- 2026-02-26
from
CREELED, INC.,
PENGUIN COMPUTING, INC.,
PENGUIN SOLUTIONS CORPORATION (DE),
SMART EMBEDDED COMPUTING, INC.,
SMART HIGH RELIABILITY SOLUTIONS LLC,
SMART MODULAR TECHNOLOGIES, INC.
PATENT SECURITY AGREEMENT
Recorded 2025-06-30
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2024-08-22
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