SYSTEMS AND METHODS FOR TESTING THERMAL CONDITIONING OF AN INTEGRATED CIRCUIT (IC)
Systems and methods for testing the thermal conditioning of an integrated circuit (IC) are disclosed. In one aspect, a device is used to apply heat to a chip, and more particularly to a memory element, while providing thermal isolation to a motherboard with which circuits in the chip may be operating. Testing sensors may monitor operation of the circuits in the chip while the heat is applied to the chip. Having a device that is easily coupled to the chip under test, readily applies heat without damaging other components on a motherboard and allows testing of the chip under test will save time and provide better test results so that chips may be certified for operation at such elevated temperatures and/or provide a better product to customers.
1 . A testing element, comprising:
a riser card comprising a heating element configured to be coupled to a power supply.
2 . The testing element of claim 1 , further comprising a socket configured to receive a chip under test.
3 . The testing element of claim 1 , further comprising a temperature sensor configured to report a temperature to a remote location.
4 . The testing element of claim 1 , further comprising an insertion blade configured to be inserted into a motherboard.
5 . The testing element of claim 1 , wherein the heating element comprises a resistor.
6 . The testing element of claim 1 , wherein the heating element comprises a Peltier device.
7 . The testing element of claim 1 , wherein the heating element comprises an internal trace conductor.
8 . A testing element comprising:
a tubular loop configured to receive a heated fluid, the tubular loop further configured to be placed around a chip under test.
9 . A method for testing a chip for thermal conditioning, comprising:
heating a chip under test that is in a socket in a riser card spaced from a motherboard, wherein the heating comprises using a heating element in the riser card; and
measuring metrics associated with the chip under test.
10 . The method of claim 9 , further comprising placing the riser card into a second socket on the motherboard.
11 . The method of claim 10 , further comprising placing the chip under test into the socket in the riser card.
12 . The method of claim 9 , wherein heating the chip under test comprises heating a memory module.
13 . The method of claim 9 , wherein heating the chip under test comprises using resistors in the riser card to heat the chip under test.
14 . The method of claim 9 , wherein heating the chip under test comprises using a Peltier device in the riser card.
15 . The method of claim 9 , further comprising sensing a temperature in the riser card with a temperature sensor.