IP Library Assignment 065680/0985
Patent Assignment
Reel/Frame 065680/0985

Assignment of Assignor's Interest

Recorded: 2023-11-28 Pages: 5
Assignors
CHANG, REUBEN
Executed: 2023-11-28
STEED, TORRY
Executed: 2023-10-30
Assignee
SMART MODULAR TECHNOLOGIES, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 39870
Covered Property (1)
Systems and Methods for Testing Thermal Conditioning of an Integrated Circuit (Ic)
Application: 18/520,843 →
Publication: US US20250172608A1
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →