Granted Patent
S1
US 1,070,144 · App. 29/876,406 · Granted Apr 8, 2025
Light-emitting diode package
Inventors:
JuZuo Sheng (Huizhou, CN); Xiang Fei (Huizhou, CN); Robert David Schmidt (Wake Forest, NC)
Assignee:
CreeLED, Inc.
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Claims (1)
The ornamental design for a light-emitting diode package, as shown and described.
Assignments (2)
PATENT SECURITY AGREEMENT
Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded May 22, 2023
From: SHENG, JUZUO; FEI, XIANG; SCHMIDT, ROBERT DAVID
To: CREELED, INC.
Reel/Frame 063716/0040 →
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