IP Library › Granted Patent US 1,124,426
Granted Patent S1
US 1,124,426 · App. 29/947,814 · Granted Apr 28, 2026

Light-emitting diode package

Inventors: Robert David Schmidt (Wake Forest, NC); Joseph M. Favale, Jr. (Cary, NC)
Assignee: CreeLED, Inc.
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Quick Facts
Patent No.
US 1,124,426
App. No.
29/947,814
Granted
Apr 28, 2026
Kind
S1
Claims (1)

The ornamental design for a light-emitting diode package, as shown and described.

Assignments (1)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →