IP Library Assignment 063356/0442
Patent Assignment
Reel/Frame 063356/0442

Assignment of Assignor's Interest

Recorded: 2023-04-18 Pages: 16
Assignors
CHECK, MICHAEL
Executed: 2023-04-17
WHITE, JUSTIN
Executed: 2023-04-18
WUESTER, STEVEN
Executed: 2023-04-18
HALL, NIKOLAS
Executed: 2023-04-17
HABERERN, KEVIN
Executed: 2023-04-18
BLAKELY, COLIN
Executed: 2023-04-18
REIHERZER, JESSE
Executed: 2023-04-18
Assignee
CREELED, INC.
4001 E HWY 54, SUITE 2000, DURHAM, NORTH CAROLINA, 27709
Covered Properties (2)
Contact Structures in Light-Emitting Diode Chips for Reduced Voiding of Bonding Metals
Application: 18/302,168 →
Publication: US 2023/0395754
Contact Structures in Light-Emitting Diode Chips for Reduced Voiding of Bonding Metals
Application: 63/365,647 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →