Patent Assignment
Reel/Frame 063369/0528
Assignment of Assignor's Interest
Recorded: 2023-04-19
Pages: 2
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board
Application:
18/019,201 →
Publication:
US 2023/0288802
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.