Patent Assignment
Reel/Frame 063371/0687
Assignment of Assignor's Interest
Recorded: 2023-04-19
Pages: 3
Assignee
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
9 DONGSHENG WEST ROAD, JIANGYIN CITY, JIANGSU PROVINCE, 214437, CHINA
Covered Property
(1)
Fan-Out Stacked Semiconductor Package Structure and Packaging Method Thereof
Application:
18/132,571 →
Publication:
US 2023/0352449