Patent Assignment
Reel/Frame 063373/0029
Assignment of Assignor's Interest
Recorded: 2023-04-19
Pages: 4
Assignors
CHEN, KAOCHAO
Executed: 2022-11-01
HO, CHIA-CHENG
Executed: 2022-11-01
LEE, CHIA-JUI
Executed: 2022-11-01
WEI, CHIA-YU
Executed: 2022-11-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(2)
Semiconductor Device and Methods of Formation
Application:
18/301,571 →
Publication:
US 2024/0145533
Semiconductor Device and Methods of Formation
Application:
63/381,679 →