Patent Assignment
Reel/Frame 063378/0023
Assignment of Assignor's Interest
Recorded: 2023-04-19
Pages: 3
Assignors
CHENG, YUN-WEI
Executed: 2020-02-26
CHOU, CHUN-HAO
Executed: 2020-02-26
LEE, KUO-CHENG
Executed: 2020-02-27
CHEN, YING-HAO
Executed: 2020-03-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heat Dissipation Structures