Patent Assignment
Reel/Frame 063380/0393
Assignment of Assignor's Interest
Recorded: 2023-04-19
Pages: 4
Assignors
HAM, TAEWOOK
Executed: 2023-04-17
KWON, MOONHYUNG
Executed: 2023-04-17
PARK, MIN
Executed: 2023-04-17
YUN, YOUNGGIRL
Executed: 2023-04-17
CHOI, TAEKKYUN
Executed: 2023-04-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Dissipation Structure and Electronic Device Including Same