Patent Assignment
Reel/Frame 063381/0824
Assignment of Assignor's Interest
Recorded: 2023-04-19
Pages: 14
Assignors
KIM, JONGHAE
Executed: 2021-04-21
SHAH, MILIND
Executed: 2021-04-11
CHIDAMBARAM, PERIANNAN
Executed: 2021-04-23
LANGARI, ABDOLREZA
Executed: 2021-04-29
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, TEXAS, 92121-1714
Covered Property
(1)
Integrated Circuit Assembly with Hybrid Bonding