Patent Assignment
Reel/Frame 063383/0940
Assignment of Assignor's Interest
Recorded: 2023-04-20
Pages: 10
Assignors
LIN, DA-JUN
Executed: 2023-04-10
CHANG, CHIH-WEI
Executed: 2023-04-10
TSAI, FU-YU
Executed: 2023-04-10
TSAI, BIN-SIANG
Executed: 2023-04-10
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Fabrication Method Thereof
Application:
18/136,888 →
Publication:
US 2024/0332066