IP Library Assignment 063386/0067
Patent Assignment
Reel/Frame 063386/0067

Assignment of Assignor's Interest

Recorded: 2023-04-20 Pages: 3
Assignors
LI, FU-HAI
Executed: 2022-09-11
ONG, YI CHING
Executed: 2022-09-11
HUANG, KUO-CHING
Executed: 2022-09-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property (1)
Phase Change Material Switch with Improved Thermal Dissipation and Methods for Forming the Same
Application: 18/303,692 →
Publication: US 2024/0099167