Patent Assignment
Reel/Frame 063425/0454
Assignment of Assignor's Interest
Recorded: 2023-04-25
Pages: 5
Assignors
SAX, HARRY WALTER
Executed: 2023-04-04
GATTERBAUER, JOHANN
Executed: 2023-04-17
LEHNERT, WOLFGANG
Executed: 2023-04-04
NAPETSCHNIG, EVELYN
Executed: 2023-04-04
ROGALLI, MICHAEL
Executed: 2023-04-24
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Chip Package and Method of Forming a Chip Package