Patent Assignment
Reel/Frame 063430/0617
Assignment of Assignor's Interest
Recorded: 2023-04-25
Pages: 4
Assignors
CHUNG, HYUNSOO
Executed: 2023-02-09
KIM, YOUNG LYONG
Executed: 2023-02-09
HWANG, INHYO
Executed: 2023-02-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same
Application:
18/122,285 →
Publication:
US 2024/0040805