Patent Assignment
Reel/Frame 063442/0402
Assignment of Assignor's Interest
Recorded: 2023-04-26
Pages: 4
Assignors
MIN, TAE HONG
Executed: 2021-06-28
HAM, HO HYUNG
Executed: 2021-06-24
JANG, YONG SOON
Executed: 2021-06-28
KIM, KI SUK
Executed: 2021-06-28
LEE, HYUNG KI
Executed: 2021-06-28
HWANG, CHI WON
Executed: 2021-06-28
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Connection Structure Embedded Substrate and Substrate Structure Including the Same